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16-layer 2+N+2 high-precision PCB design - 그리고

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16-layer 2+N+2 high-precision PCB design

이름: 16-layer two-stage high-precision PCB design

그릇: TG170 /TG180, F4BM, FR4, FR1-4, 등.

디자인 가능한 레이어: 1-32 레이어

최소 줄 너비 및 줄 간격: 3밀

최소 레이저 조리개: 4밀

최소 기계적 조리개: 8밀

동박 두께: 18-175cm (기준: 18cm35cm70cm)

박리강도: 1.25N/mm

최소 펀칭 구멍 직경: 단면: 0.9mm/35mil

최소 구멍 직경: 0.25mm/10mil

조리개 허용 오차: ≤Φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

  • 제품 세부정보

Overview of 16-Layer Stack PCB

A 16-layer stack has 16 layers of routing and is typically used for high-density designs.

Routing Challenges and Solutions

Routing Challenges

In EDA applications, routing techniques often fail to route the design.

Solution: Adding Multiple Layers

That’s why manufacturers add multiple layers to accommodate the complexity of high-density designs.

Specifications of 16-Layer PCB Fabrication

Composition

  • Made of 16 레이어
  • Made of halogen-free materials, 알류미늄, CEM, and FR

Plate Thickness

  • Extended to 7 mm

Board Size

  • Maximum finished board size is 500 x 500 mm

Finishes

  • Halogen-free gold and silver plated

UGPCB: High-Quality Fabrication

UGPCB offers high-quality fabrication of 16-layer stack PCBs, ensuring reliability and performance for high-density designs.

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