24 Layers Communication backplane PCB

Introduction to the 24 Layers Communication Backplane PCB

그만큼 24 Layers Communication Backplane PCB is a high-performance printed circuit board designed for complex communication systems. It is engineered to provide robust connectivity and reliable signal transmission, making it ideal for advanced telecommunication applications.

What is a 24 Layers Communication Backplane PCB?

에이 24 Layers Communication Backplane PCB refers to a multilayered printed circuit board that has been specifically designed with 24 layers of conductive material separated by dielectric layers. This structure allows for high-density interconnectivity while maintaining signal integrity and minimizing interference.

설계 요구 사항

The design requirements for a 24 Layers Communication Backplane PCB are stringent due to its application in critical communication systems. Key design considerations include:

재료: 파나소닉 M6, known for its excellent thermal and electrical properties.
레이어 수: 24 layers to accommodate complex routing needs.
색상: Blue/White for easy identification and aesthetic appeal.
완성된 두께: 2.0mm to ensure structural integrity without being overly bulky.
구리 두께: 1OZ to provide adequate conductivity.
표면 처리: Immersion Gold to enhance solderability and corrosion resistance.

어떻게 작동하나요??

그만큼 24 Layers Communication Backplane PCB works by using multiple layers of copper traces separated by dielectric materials. These layers are interconnected through plated through-holes (PTHs) or vias, allowing signals to travel between different layers. The immersion gold surface treatment ensures that the copper traces remain conductive and resistant to oxidation.

응용

The primary application of the 24 Layers Communication Backplane PCB is in communication backplanes where high-speed data transmission and reliable connectivity are crucial. These PCBs are used in:

Telecom infrastructure
데이터 센터
High-frequency communication devices
Networking equipment

분류

Based on its features and applications, 그만큼 24 Layers Communication Backplane PCB can be classified as a high-multilayer PCB. This classification highlights its capability to handle complex and dense circuit designs required for modern communication systems.

재료 구성

The core material used in the 24 Layers Communication Backplane PCB is Panasonic M6, a high-performance laminate material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of high-speed communication applications.

성능 특성

The performance characteristics of the 24 Layers Communication Backplane PCB include:

High signal integrity
Low signal loss
Superior thermal management
Enhanced mechanical strength
Reliable long-term stability

Structural Details

The structural details of the 24 Layers Communication Backplane PCB are as follows:

레이어 수: 24 레이어
완성된 두께: 2.0mm
구리 두께: 1온스
Minimum Trace Width: 6밀 (0.15mm)
Minimum Space Between Traces: 6밀 (0.15mm)
표면 처리: 이머젼 골드

Features and Benefits

The key features and benefits of the 24 Layers Communication Backplane PCB include:

High density interconnectivity
Excellent signal integrity
Robust mechanical construction
Reliable long-term performance
Aesthetic color options (블루/화이트)

생산 과정

The production process of the 24 Layers Communication Backplane PCB involves several steps, 포함:

재료 선택: Choosing high-quality Panasonic M6 material.
레이어 스태킹: Arranging the 24 layers with precision.
에칭: Removing excess copper to form the desired trace patterns.
도금: Applying immersion gold surface treatment.
집회: Incorporating PTHs and vias for layer interconnections.
Testing: Ensuring the PCB meets all performance specifications.

사용 사례

그만큼 24 Layers Communication Backplane PCB is used in various scenarios, ~와 같은:

High-speed data transmission networks
Telecommunication infrastructure projects
Advanced networking equipment
Data center applications requiring high bandwidth

요약하면, 그만큼 24 Layers Communication Backplane PCB is a sophisticated and reliable component designed to meet the demanding requirements of modern communication systems. Its high-density design, excellent performance characteristics, and robust construction make it an essential part of any advanced telecommunication setup.