HDI PCB (2+N+2) 특징
Advanced BGA Capabilities
- For BGAs with smaller ball pitch and higher I/O count
High Routing Density
- Increase routing density in complex designs
Sheet Capability
- Sheet Capability (Further details may be needed to elaborate on this feature)
Superior Signal Transmission
- Lower Dk/Df material for better signal transmission performance
Enhanced Connectivity
- Copper filled vias
응용
가전제품
- Mobile phones
- PDAs (Personal Digital Assistants)
- UMPCs (Ultra-Mobile Personal Computers)
- Portable game consoles
- Digital cameras
- Camcorders