UGPCB 로고
Overview of the 8L 8L 2+N+2 HDI PCB Product
The 8L 8L 2+N+2 HDI PCB product is a high-density interconnect printed circuit board designed for advanced electronic applications. It features a complex structure with multiple layers and specialized processes to meet the demands of modern intelligent digital products.
정의 및 설계 요구 사항
The 8L 8L 2+N+2 HDI PCB stands for a printed circuit board with eight layers on each side, two power layers, N개의 신호 레이어, and two additional signal layers. The design requirements include high density, precise trace and space measurements, and specific hole sizes for mechanical and laser drilling.
작동 원리
The HDI PCB works by providing intricate electrical connections between various components on the board. The high-density layout allows for more components to be packed into a smaller space, improving overall functionality and performance.
응용
These PCBs are primarily used in intelligent digital products where compact size, 고성능, and reliability are crucial. They are ideal for applications such as smartphones, 정제, 및 기타 휴대용 전자 장치.
분류
HDI PCBs can be classified based on their layer count, 재료, and special processes. The 8L 8L 2+N+2 configuration indicates a specific type of multilayer PCB with enhanced capabilities.
재료
The primary material used for this PCB is FR-4, which is a flame-resistant glass-epoxy laminate. This material provides excellent thermal stability, 기계적 강도, and electrical insulation properties.
성능
The 8L 8L 2+N+2 HDI PCB offers superior electrical performance, including low signal loss and high-speed data transmission. Its immersion gold and OSP surface treatments ensure long-lasting durability and reliable connections.
구조
The structure of this PCB includes eight layers on each side, with internal and external copper thicknesses of 1OZ and 0.5OZ, 각기. The finished thickness of the board is 1.0mm, and it features blind holes for increased connectivity.
특징
Key features of this PCB include:
- High-density interconnect design
- Precision trace and space measurements (3밀/3밀)
- Mechanical holes of 0.2mm and laser holes of 0.1mm
- Specialized surface treatments for enhanced durability
생산 과정
The production process for an 8L 8L 2+N+2 HDI PCB involves several steps, 포함:
- Material preparation and layer stacking
- Drilling of mechanical and laser holes
- Copper plating and etching
- Surface treatment application
- Final inspection and testing
Each step is carefully executed to ensure the highest quality and performance of the final product.
사용 사례
This PCB is commonly used in:
- Smartphones and tablets
- Wearable technology
- High-density computing systems
- Advanced communication devices
결론적으로, the 8L 8L 2+N+2 HDI PCB product is a state-of-the-art solution for modern intelligent digital products, offering unparalleled performance, 신뢰할 수 있음, and compactness.
