36layers high tg backplane pcb

Overview of the 36-Layer High TG Backplane PCB

The 36-Layer High TG Backplane PCB is a high-density, multilayer printed circuit board (PCB) designed for backplane applications. This PCB is ideal for complex electronic systems that need to manage high power and signal integrity.

What is a 36-Layer High TG Backplane PCB?

A 36-Layer High TG Backplane PCB is a printed circuit board (PCB) with 36 layers of conductive material separated by insulating layers, specifically designed for backplane applications. The term “High TG” refers to the glass transition temperature, indicating the PCB’s ability to withstand high temperatures without losing its mechanical and electrical properties.

설계 요구 사항

The design requirements for a 36-Layer High TG Backplane PCB are stringent to ensure its performance and reliability:

재료: 높은 TG FR4, chosen for its excellent electrical and thermal properties.
레이어 수: 36 layers to accommodate complex and dense circuit designs.
색상: Green/White for easy identification and aesthetic appeal.
완성된 두께: 2.4mm to provide structural integrity and durability.
구리 두께: 1OZ to ensure adequate conductivity and heat dissipation.
표면 처리: Immersion Gold to enhance solderability and corrosion resistance.
Minimum Trace and Space: 4밀(0.1mm) to support fine circuit patterns.
특성: High multilayer, Panasonic M6 PCB material, known for its high reliability and performance.

어떻게 작동하나요??

The 36-Layer High TG Backplane PCB works by providing a platform for various electronic components to be interconnected through conductive pathways. These pathways, or traces, are made of copper and are etched onto the board. The high TG FR4 material ensures that the PCB can withstand high temperatures without losing its mechanical and electrical properties, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

응용

The primary application of the 36-Layer High TG Backplane PCB is in backplane applications where it manages and regulates the flow of electrical signals. This includes:

Data communication devices
Networking equipment
Industrial control systems
Telecommunication infrastructure

분류

Based on its features and applications, the 36-Layer High TG Backplane PCB can be classified as a high-speed digital PCB designed for backplane applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

재료 구성

The core material used in the 36-Layer High TG Backplane PCB is High TG FR4, a high-performance composite material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of backplane applications.

성능 특성

The performance characteristics of the 36-Layer High TG Backplane PCB include:

High signal integrity
Low signal loss
Superior thermal management
Robust mechanical strength
Long-term stability

Structural Details

The structural details of the 36-Layer High TG Backplane PCB are as follows:

레이어 수: 36 레이어
완성된 두께: 2.4mm
구리 두께: 1온스
표면 처리: 이머젼 골드
Minimum Trace and Space: 4밀(0.1mm)
특성: High multilayer, Panasonic M6 PCB material

Features and Benefits

The key features and benefits of the 36-Layer High TG Backplane PCB include:

High density interconnectivity
Excellent signal integrity
Robust mechanical construction
Reliable long-term performance
Aesthetic color options (녹색/백색)

생산 과정

The production process of the 36-Layer High TG Backplane PCB involves several steps including:

재료 선택: Choosing high-quality High TG FR4 material.
레이어 스태킹: Arranging the 36 layers with precision.
에칭: Removing excess copper to form the desired trace patterns.
Solder Mask Application: Applying a solder mask layer to protect the copper traces.
도금: Applying immersion gold surface treatment.
집회: Incorporating PTHs and vias for layer interconnections.
Testing: Ensuring the PCB meets all performance specifications.