4L 1+N+1 HDI Wifi Module

Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview

The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.

정의

A High-Density Interconnect (HDI) module refers to a printed circuit board (PCB) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. 그만큼 “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.

설계 요구 사항

The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:

레이어: Four layers with a specific stack-up of 1+N+1.
재료: Made from high-quality FR-4 material.
두께: The overall finished thickness of the module is 1.0mm.
구리 두께: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
표면 처리: Incorporates immersion gold and Organic Solderability Preservatives (OSP) for enhanced durability and solderability.
최소 추적/공간: Supports minimal trace and space widths of 4mil.
최소 구멍: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.

작동 원리

The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.

응용

This versatile module is suitable for a wide range of applications including but not limited to:

가전제품: 스마트폰, 정제, smart home devices.
산업용 장비: Automation systems, control panels.
Communication Devices: Routers, access points, set-top boxes.

분류

The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.

재료 구성

FR-4로 제작, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.

성능 특성

Signal Integrity: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
열 관리: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
내구성: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.

Structural Features

Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
Layer Stack-Up: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.

생산 과정

The manufacturing process involves several key steps:

재료 준비: Cutting and preparing the FR-4 substrate.
Copper Lamination: Applying copper layers on both sides and inner layers as per design.
에칭: Removing excess copper to form the desired circuit patterns.
Layer Alignment: Stacking and aligning the layers accurately.
본딩: 열과 압력을 사용하여 층을 서로 결합.
표면 처리: Applying immersion gold and OSP finishes.
품질 관리: Conducting thorough inspections and tests to ensure product quality.

Use Case Scenarios

가전제품

In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.

산업용 장비

For automation systems, the module provides dependable communication links in harsh industrial environments.

Communication Devices

In routers and access points, the module enhances network performance with its superior signal handling capabilities.

By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.