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Aluminum nitride ceramic PCB - 그리고

특수 PCB/

Aluminum nitride ceramic PCB

모델 : Aluminum nitride ceramic PCB

재료 : 세라믹 PCB, Ceramic Substrate

층 : 2Layer Ceramic PCB

색상 : 하얀색

두께 : Aluminum nitride 0.635mm

구리 두께 : 1온스(35하나)

표면 처리 : 이머젼 골드

Gold thick : >=3U"

최소 조리개 : 0.8mm

Process features : through hole, ceramic dam technology

  • 제품 세부정보

재료 구성

The Aluminum Nitride Ceramic PCB is composed of high-quality ceramic materials, specifically ceramic PCB and ceramic substrate. This combination ensures exceptional thermal conductivity and electrical insulation properties.

성능 특성

The PCB features a 2-layer ceramic structure with a white color appearance. The thickness of the aluminum nitride layer is precisely 0.635mm, providing a sturdy base for components. The copper thickness of 1OZ (35하나) ensures good electrical conductivity, while the immersion gold surface treatment with a gold thickness of >=3Uenhances corrosion resistance and ensures smooth soldering processes.

독특한 특징

  • 높은 열전도율: Aluminum nitride offers excellent thermal conductivity, making it suitable for high-power and high-frequency applications.
  • 내구성: Ceramic materials are known for their hardness and durability, contributing to the PCB’s long lifespan.
  • 정도: The minimum aperture of 0.8mm allows for the placement of fine components, ensuring high-density packaging.

생산 과정

The production of Aluminum Nitride Ceramic PCBs involves several critical steps:

  1. 재료 준비: High-quality aluminum nitride powder and other ceramic materials are mixed and pressed into the desired shape.
  2. Sintering: The pressed ceramic substrate undergoes sintering at high temperatures to achieve the required density and strength.
  3. Copper Deposition: A layer of copper is deposited on the ceramic substrate using advanced metallization techniques.
  4. Circuit Patterning: The copper layer is etched to form the desired circuit patterns.
  5. Hole Drilling: Through holes are drilled to allow for interconnections between layers.
  6. Ceramic Dam Technology: This unique technology ensures the precise alignment and sealing of holes, enhancing the PCB’s reliability.
  7. 표면 처리: The PCB undergoes immersion gold plating to provide a corrosion-resistant surface finish.

응용 시나리오

Aluminum Nitride Ceramic PCBs are ideal for various high-performance applications:

  • High-Power Electronics: Suitable for use in power supplies, inverters, and other high-power electronic devices due to their excellent thermal management capabilities.
  • 고주파 회로: Perfect for RF and microwave circuits that require low loss and high stability.
  • 의료 장비: Used in medical devices that demand precision, 신뢰할 수 있음, and high-performance electronics.
  • 항공우주 및 국방: Ideal for applications in harsh environments where durability and thermal resistance are crucial.

요약하면, Aluminum Nitride Ceramic PCBs offer a combination of exceptional thermal conductivity, 내구성, and precision, making them ideal for high-performance electronics across various industries.

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