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안테나 PCB RO4350B 고주파 4 레이어 ENIG 보드 - 그리고

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안테나 PCB RO4350B 고주파 4 레이어 ENIG 보드

모델: Ro4350B Ceramic Hybrid High Frequency PCB

재료: Rogers RO4350B+FR4 Mixing Press

층: 4엘

D K: 3.48

완성된 두께: 1.0MM

구리 두께: 1온스

유전체 두께: 0.762mm

열전도율: 0.69월/m.k

가연성: 다섯-0

표면 처리: 이머젼 골드

애플리케이션: 무선 주파수, Microwave Antenna

  • 제품 세부정보

재료 구성

The Antenna PCB RO4350B High Frequency 4 Layer ENIG Board is crafted using a unique blend of Rogers RO4350B and FR4 materials. 로저스 RO4350B, a ceramic-filled polytetrafluoroethylene (PTFE) composite, is renowned for its low loss tangent and stable dielectric constant, making it ideal for high-frequency applications. Mixed with FR4, a standard flame-retardant epoxy glass-cloth laminate, it provides both mechanical strength and cost-effectiveness.

성능 특성

  • 유전 상수 (DK): 3.48, ensuring consistent signal propagation and minimal signal loss across a wide frequency range.
  • 완성된 두께: 1.0MM, offering a compact design suitable for space-constrained applications.
  • 구리 두께: 1온스, ensuring excellent conductivity and durability.
  • 유전체 두께: 0.762mm, optimized for impedance control and signal integrity.
  • 열전도율: 0.69월/m.k, allowing for efficient heat dissipation, crucial in high-power radio frequency (RF) circuits.
  • 가연성 등급: 다섯-0, ensuring safety compliance in various electronic devices.

생산 과정

The production of the Antenna PCB RO4350B involves several meticulous steps:

  1. 재료 준비: Rogers RO4350B and FR4 materials are precisely cut and prepared for lamination.
  2. 라미네이션: The materials are pressed together under controlled conditions to ensure uniform bonding.
  3. Circuit Patterning: Using advanced photolithography, the copper circuits are etched onto the laminated board.
  4. 도금: An immersion gold (동의하다) surface treatment is applied to provide a protective layer that enhances electrical contact and corrosion resistance.
  5. 품질 관리: Each board undergoes rigorous testing to ensure dimensional accuracy, electrical performance, and surface finish quality.

응용 시나리오

High-Frequency Radio Applications
The Antenna PCB RO4350B is specifically tailored for radio frequency (RF) and microwave antenna applications. Its low loss tangent and stable dielectric properties make it ideal for use in high-frequency circuits where signal integrity and performance are paramount.

Compact Electronic Devices
Due to its compact 1.0MM thickness and excellent thermal conductivity, this PCB is well-suited for use in space-constrained electronic devices, such as smartphones, 정제, and wearable technology, where both size and thermal management are critical factors.

Antenna Arrays and Systems
In antenna arrays and complex RF systems, the consistent dielectric constant and impedance control of the RO4350B material contribute to enhanced signal reception and transmission, making it an excellent choice for telecommunications, 레이더, and satellite communication systems.

결론

The Antenna PCB RO4350B High Frequency 4 Layer ENIG Board combines the superior electrical properties of Rogers RO4350B with the cost-effectiveness and mechanical strength of FR4, making it a versatile solution for high-performance RF and microwave antenna applications. Its meticulous production process ensures reliability and quality, while its compact design and excellent thermal conductivity cater to the demands of modern electronic devices.

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