Communication motherboard Turnkey PCB Assembly

고주파 하이브리드 부목에는베이스 플레이트가 포함됩니다, 첫 번째 내부 와이어 층에 접고 배치됩니다., 첫 번째 외부 와이어 레이어, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate follow. The substrate includes a second layer of solder resist ink. The substrate comprises a high-frequency area and an auxiliary area; the auxiliary area is fixed, and the high-frequency area inlay should be positioned accordingly.

유틸리티 모델은 고주파 하이브리드 부목을 제공합니다, divided into two parts: 고주파 지역 및 보조 영역, providing mechanical support. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signal requirements.

High Frequency Hybrid Product Classification:

• 레이어: 6
• 중고 보드: RO4350B + FR4
• 두께: 1.6mm
• 크기: 210mm x 280mm
• 표면 처리: 금도금
• 최소 조리개: 0.25mm
• 애플리케이션: 의사소통
• 특징: 고주파 혼합 압력

We provide Communication motherboard Turnkey PCB Assembly services. UGPCB is your one-stop Turnkey PCB Assembly company.