무거운 구리 PCB

Heavy Copper PCB Overview

The Heavy Copper PCB is a specialized type of printed circuit board designed to handle high current applications. It features an increased copper thickness compared to standard PCBs, making it ideal for power-intensive electronics. Below is a detailed introduction to this advanced PCB technology.

분류

Heavy Copper PCBs are primarily classified based on their copper thickness. Common classifications include 2OZ, 3온스, 4온스, up to 6OZ (or 70um and above). 여기에 소개 된 모델, 무거운 구리 PCB, offers copper thicknesses of 2OZ and 6OZ, tailored to meet various high-power requirements.

재료 구성

The Heavy Copper PCB utilizes SY S1141 as its base material, a high-quality substrate known for its electrical and mechanical properties. The PCB is constructed with 6 레이어, ensuring robust performance and reliability.

성능 특성

Heavy Copper PCBs excel in handling high currents due to their thick copper layers. They also offer excellent thermal conductivity, which helps in dissipating heat efficiently. The surface technology used, 이머젼 골드 (1-3유), provides a protective coating that enhances corrosion resistance and improves solderability.

구조 설계

구조적으로, the Heavy Copper PCB features a board thickness of 2.8mm, providing a sturdy base for components. The green soldermask color not only enhances visual appeal but also provides insulation and protection against environmental factors. The white silk screen adds to the board’s readability by clearly marking component locations and other essential information.

독특한 특징

The defining feature of Heavy Copper PCBs is their ability to carry high currents without overheating or experiencing excessive voltage drop. This is achieved through the use of thick copper layers, which also contribute to the board’s overall durability. 추가적으로, the immersion gold surface finish ensures long-term reliability and ease of soldering.

생산 과정

The production of Heavy Copper PCBs involves several precision steps:

1. Base Material Preparation: The SY S1141 substrate is prepared and cut to size.
2. 구리 라미네이션: Thick copper foil is laminated to the substrate using advanced bonding techniques.
3. 회로 패터닝: The desired circuit patterns are etched onto the copper foil.
4. 층 스태킹 및 라미네이션: Multiple layers are stacked and laminated together to form the final PCB structure.
5. 시추 및 도금: 구성 요소 장착 및 상호 연결을 위해 구멍이 뚫린다, followed by plating to enhance conductivity.
6. 솔더 마스크 응용 프로그램: A green soldermask is applied to protect the circuits and provide insulation.
7. Silk Screen Printing: White silk screen ink is used to print component labels and other markings.
8. 표면 마감 적용: The immersion gold coating is applied to the PCB surface.
9. 최종 검사 및 테스트: The PCB undergoes rigorous inspection and testing to ensure quality and performance.

응용 시나리오

Heavy Copper PCBs are widely used in power converter applications due to their ability to handle high currents and dissipate heat efficiently. They are also suitable for other high-power electronics, such as inverters, motor controllers, and battery management systems. 이 응용 프로그램에서, Heavy Copper PCBs ensure reliable performance and extended product lifespan.