UGPCB 로고
Hybrid PCB is commonly used in microwave RF series products
전자통신기술의 급속한 발전으로, in order to achieve high-speed and high-fidelity signal transmission, more and more microwave radio frequency PCBs are used in communication equipment. 고주파 하이브리드 회로 기판에 사용되는 유전체 재료는 우수한 전기적 특성과 우수한 화학적 안정성을 가지고 있습니다., which are mainly manifested in the following four aspects.
1. Hybrid PCB has the characteristics of low signal transmission loss, 짧은 전송 지연 시간, and low signal transmission distortion.
2. 우수한 유전 특성 (주로 낮은 비유전율 DK를 나타냅니다., 낮은 유전 손실 계수 DF). 게다가, 유전 특성 (DK, DF) remain stable under environmental changes such as frequency, humidity and temperature.
3. High-precision characteristic impedance control.
4. 하이브리드 PCB는 내열성이 우수합니다. (TG), processability and adaptability.
Microwave high-frequency hybrid PCBs are widely used in communication equipment such as wireless antennas, base station receiving antennas, 전력 증폭기, 레이더 시스템, navigation systems, 등.
Based on one or more factors such as cost saving, improving bending strength and controlling electromagnetic interference, high-frequency lamination design must use high-frequency prepreg with low resin flow and FR-4 substrate with smooth dielectric surface. High-frequency composite laminate. 이 경우, there is a great risk of product adhesion control during the pressing process.
Microwave high-frequency hybrid PCB stacking method and characteristics
1. A high-frequency hybrid PCB controllable depth composite lamination structure, 고주파 하이브리드 PCB에는 L1 구리층이 포함되어 있습니다. (고주파 시트), L2 구리층 (PP 시트), L3 구리층 (에폭시 수지 기판), L4 copper layer in sequence; L2, L3, L4 copper layers are provided with slots of the same size at the same position; L4 copper layer is arranged with three-in-one buffer material from inside to outside, and steel plate and kraft paper are stacked from outside to outside in sequence; aluminum plate, steel plate, and kraft paper are stacked on L1 copper layer from inside to outside.
2. According to the first feature, the three-in-one buffer material is a buffer material sandwiched between two layers of release film.
3. According to the first feature, the laminated structure of the high-frequency board controlled deep hybrid board of the present invention is characterized in that the high-frequency sheet is a polytetrafluoroethylene board.
The expansion and contraction characteristics of the high-frequency hybrid PCB composite board are different from those of the ordinary epoxy resin substrate, so the warping and shrinkage of the board are difficult to control, and the processing method of first grooving and then pressing will cause the problem of metal dents on the board. The three-in-one buffer material is set on one side of the groove, and the buffer material can be filled into the groove hole during pressing to avoid the problem of dents. Kraft paper buffer pressure is set on both sides of the cardboard to balance the heat transfer uniformly, and the steel plate is set to ensure uniform heat conduction during pressing, so that the pressing is flat, and the heat and pressure during the pressing process are balanced, so as to better control the curvature and expansion of the board.
5G 통신 기술의 급속한 발전으로, higher frequency requirements are put forward for communication equipment. There are many microwave high-frequency hybrid PCBs on the market. 이러한 마이크로파 고주파 하이브리드 PCB의 제조 기술은 또한 더 높은 요구 사항을 제시합니다.. We have been specialized in UGPCB processing for more than 10 years and can provide multi-layer hybrid PCB manufacturing services. We have all the equipment required for the entire process of multi-layer hybrid PCB production, comply with the ISO9001-2000 international standard management system, and have passed the iatf16949 and ISO 14001 시스템 인증. Our products have passed UL certification and comply with IPC-A-600G and IPC-6012A standards. We can provide high-quality, high-stability, and high-adaptability microwave high-frequency hybrid PCB samples and batch services.
