UGPCB 로고
Base Plate Structure and Positioning
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order.
Layer Composition and Auxiliary Area Fixation
The second layer of solder resist ink layer is also present. The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and the inlay in the high-frequency area should be located at a fixed position.
High-Frequency Hybrid Splint Utility Model
Division into High-Frequency and Auxiliary Areas
The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. These areas provide mechanical support.
Independent Arrangement of High-Frequency Area
The utility model discloses that the high-frequency area is independently arranged. Only the high-frequency area is made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production cost while satisfying high-frequency signals.
High Frequency Hybrid Product Specifications
Classification and Material
- 레이어: 6
- Used Board: RO4350B + FR4
- 두께: 1.6mm
- 크기: 210mm*280mm
Surface Treatment and Aperture
- 표면 처리: Gold-plated
- Minimum Aperture: 0.25mm
Application and Features
- 애플리케이션: 의사소통
- 특징: High Frequency Mixed Pressure
By following these specifications and design principles, the UGPCB (formerly known as kingford) ensures optimal performance and cost-effectiveness in high-frequency applications.
