PCB Capability
General Specifications
- Layer count: 1-48 레이어
- 재료: fr4, Tg=135,150,170,180,210, cem-3, cem-1, al base, teflon, 로저스, nelco
- 구리 두께: 1/2온스, 1온스, 2온스, 3온스, 4온스, 5온스
- 보드 두께: 8-236밀 (0.2-6.0mm)
- Min. line width/space: 3/3 밀 (75/75하나)
- Min. drill size: 8 밀 (0.2mm)
- Min. HDI laser drill size: 3 밀 (0.067mm)
- Tolerance of hole size: 2 밀 (0.05mm)
- PTH copper thickness: 1 밀 (25 하나)
표면 마무리
- 솔더 마스크 색상: 녹색, blue, 노란색, 하얀색, 검은색, 빨간색
- Peelable solder mask: 예
- Surface treating: HASL (ROHS), 동의하다, OSP, IMMERSION SILVER, IMMERSION TIN, 플래시 골드, 금손가락
- 금 두께: 2-30u” (0.05-0.76하나)
Advanced Features
- Blind hole/buried hole: 예
- V-cut: 예
PCBA Capability
기술 & 용량
- 기술: SMT, THT
- SMT capability: 2,000,000 points per day
- DIP capability: 300,000 points per day
Expertise & 프로세스
- Experiences: MFF, BGA, μBGA, CBGA
- 프로세스: Lead-free
- Programming: 예
- Conformal coating: 예
애플리케이션
핵심산업
- Industrial control
- Medical device
- Food equipment
- Laser module
- Communication device
- PLC module
- Transducer module
- Traffic control
- 자동차
- Smart home system
Customized OEM Services
UGPCB is a professional one-stop PCBA service factory, supporting customized OEM electronic medical equipment PCB services. Welcome to learn more about our company.