P2.9 led printed circuit board

Overview of the P2.9 LED Printed Circuit Board

The P2.9 LED Printed Circuit Board (PCB) is a specialized PCB designed for use with P2.9 LED modules, which are commonly used in high-resolution display applications. This PCB is ideal for creating large, seamless LED displays.

What is a P2.9 LED Printed Circuit Board?

A P2.9 LED Printed Circuit Board is a printed circuit board (PCB) specifically designed to accommodate and connect P2.9 LED modules. The term “P2.9” refers to the pixel pitch of the LED module, which measures 2.9 millimeters between each pixel. This PCB ensures that the LED modules can be interconnected efficiently, providing a stable platform for the electronic components.

설계 요구 사항

The design requirements for a P2.9 LED Printed Circuit Board are stringent to ensure its performance and reliability:

재료: SY1000-2 TG170 FR4, chosen for its excellent electrical and thermal properties.
레이어 수: 6 layers to accommodate the necessary circuitry and signal integrity.
색상: Black/White for easy identification and aesthetic appeal.
완성된 두께: 1.0mm to provide structural integrity and durability.
구리 두께: 1OZ to ensure adequate conductivity and heat dissipation.
표면 처리: Immersion Gold to enhance solderability and corrosion resistance.
Minimum Trace and Space: 4밀(0.1mm) to support fine circuit patterns.
특성: More pads with small spacing to accommodate the dense layout of P2.9 LED modules.

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The P2.9 LED Printed Circuit Board works by providing a platform for various electronic components to be interconnected through conductive pathways. These pathways, or traces, are made of copper and are etched onto the board. The SY1000-2 TG170 FR4 material ensures that the PCB can withstand the demands of LED display applications, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

응용

The primary application of the P2.9 LED Printed Circuit Board is in high-resolution LED display systems where it manages and regulates the flow of electrical signals. This includes:

Indoor and outdoor LED displays
Digital signage
Large format video walls
Event stages and concert screens

분류

Based on its features and applications, the P2.9 LED Printed Circuit Board can be classified as a high-density, high-speed digital PCB designed for LED display applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

재료 구성

The core material used in the P2.9 LED Printed Circuit Board is SY1000-2 TG170 FR4, a high-performance composite material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of LED display applications.

성능 특성

The performance characteristics of the P2.9 LED Printed Circuit Board include:

High signal integrity
Low signal loss
Superior thermal management
Robust mechanical strength
Long-term stability

Structural Details

The structural details of the P2.9 LED Printed Circuit Board are as follows:

레이어 수: 6 레이어
완성된 두께: 1.0mm
구리 두께: 1온스
표면 처리: 이머젼 골드
Minimum Trace and Space: 4밀(0.1mm)
특성: More pads with small spacing to accommodate the dense layout of P2.9 LED modules.

Features and Benefits

The key features and benefits of the P2.9 LED Printed Circuit Board include:

High density interconnectivity
Excellent signal integrity
Robust mechanical construction
Reliable long-term performance
Aesthetic color options (Black/White)

생산 과정

The production process of the P2.9 LED Printed Circuit Board involves several steps including:

재료 선택: Choosing high-quality SY1000-2 TG170 FR4 material.
레이어 스태킹: Arranging the 6 layers with precision.
에칭: Removing excess copper to form the desired trace patterns.
Solder Mask Application: Applying a solder mask layer to protect the copper traces.
도금: Applying immersion gold surface treatment.
집회: Incorporating PTHs and vias for layer interconnections.
Testing: Ensuring the PCB meets all performance specifications.