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RO4350B + IT180 고주파수 PCB - 그리고

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RO4350B + IT180 고주파수 PCB

모델 : RO4350B + IT180 Mix Laminate High Fequency PCB Board

재료 : Rogers RO4350B+IT180 Mixing Press

층 : 6엘

DK : 3.48

완성된 두께 : 1.5MM

구리 두께 : 1온스

Impedence Control : 50ohm

유전체 두께 : 0.508mm

열전도율 : 0.69월/m.k

Blind Hole : 1L~2L HDI

표면 처리:이머젼 골드

  • 제품 세부정보

재료

Advanced Composite Material

The RO4350B + IT180 Mix Laminate High Frequency PCB Board is made from a mix of Rogers RO4350B and IT180. Rogers RO4350B is a high-performance microwave/RF laminate known for its low loss, 높은 안정성, and excellent processability. IT180 is a reinforced glass fiber material that provides additional mechanical strength and thermal stability. This mixed material enables the PCB board to exhibit excellent performance and reliability in high-frequency applications.

성능

Outstanding Electrical Performance

  • 유전 상수 (DK): 3.48
    • A stable dielectric constant helps reduce signal loss and delay, ensuring the quality of high-frequency signal transmission.
  • 임피던스 제어: 50 Ohms
    • A standard impedance value ensures matched and stable signal transmission, reducing reflections and interference.
  • 유전체 두께: 0.508 mm
    • An appropriate dielectric thickness further enhances the high-frequency signal transmission performance.

Excellent Thermal Management

  • 열전도율: 0.69월/m.k
    • High thermal conductivity material aids in heat dissipation, protecting circuits from overheating damage and ensuring stability in high-power applications.

Advanced Production Process

  • 레이어 수: 6 레이어
    • A six-layer design accommodates complex circuit layouts and wiring requirements.
  • Blind Hole: 1L~2L HDI
    • 고밀도 상호 연결 (HDI) blind hole technology enables a more compact circuit layout and higher signal transmission efficiency.
  • 구리 두께: 1 Ounce
    • Adequate copper thickness provides good current carrying capacity and signal transmission performance.
  • 표면 처리: 이머젼 골드
    • Immersion gold surface treatment offers excellent electrical conductivity and corrosion resistance, enhancing circuit reliability and stability.

생산 과정

Raw Material Preparation

  • Prepare Rogers RO4350B and IT180 mixed materials, as well as auxiliary materials such as copper foil and solder mask ink.

h3: Laminating and Pressing

  • Laminate and press the mixed materials according to the designed number of layers to form a multilayer board structure.

Drilling and Plating

  • Drill holes using laser or mechanical methods to create the required circuit channels.
  • Plate the drilled holes with copper to enhance the reliability of circuit connections.

Circuit Patterning and Solder Masking

  • Create circuit patterns on the multilayer board and apply a solder mask to protect the circuits from external environmental factors.

Surface Treatment and Testing

  • Apply immersion gold surface treatment to improve the electrical conductivity and corrosion resistance of the circuits.
  • Conduct rigorous electrical performance and reliability testing on the finished products to ensure quality.

응용 시나리오

Wireless Communication Devices

  • Suitable for various wireless communication devices, such as mobile phones, base stations, and routers, providing stable high-frequency signal transmission.

Radar Systems

  • In radar systems, the RO4350B + IT180 Mix Laminate PCB can withstand high power and high-speed signals, ensuring the accuracy and reliability of the radar system.

High-Speed Data Transmission Equipment

  • Suitable for high-speed data transmission equipment, such as data center switches and storage devices, providing high-speed and stable signal transmission channels.

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