UGPCB 로고
Company Introduction
Who We Are?
Shenzhen UGPCB Technology Co., 주식회사. was founded in 1999. We are a manufacturer specialized in PCB Assembly (SMT, 담그다, AI) and electronic product final assembly (EMS) for global customers in the top market.
Our Capabilities
We have more than 10 years of SMT manufacturing experience with well-appointed SMT, 담그다, and assembly lines. We offer one-stop services including SMT, FPC, 담그다, EMS, conformal coating, 테스트, final assembly, component procurement, 설계, and peripheral products support. Our factory is equipped with high-speed and accurate SMT equipment, and we provide a range of SPI, AOI, ICT, FCT, X-RAY, ROHS, and aging testing for products. All our shop floors are dust-free, all lines are lead-free, and we are an ISO9001 certified company.
Our Market Focus
We provide BOM cost quotations with a high-quality control strategy and 8D analysis method. We focus on top-market customers, such as those in the medical, 산업의, financial, robotic, 자동차, and New Energy sectors.
Our Clients
We service many global customers, including the leader in grain processing and solution provision, the top 3 medical industry customers in China, and the global leader in Telehealth Sensors.
Services Offered
PCB Capability and Services
- Types of PCBs: Single-sided, 양면, and multi-layer PCBs; FPC; Flex Rigid PCB with competitive pricing, good quality, and excellent service.
- 재료: CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, 폴리이미드, 등.
- Surface Treatments: HAL, HAL lead-free, Immersion Gold/Silver/Tin, OSP.
- Quantities: From sample to mass order.
- Testing: 100% E-Test.
SMT and DIP Services
- Material Sourcing: Material sourcing service.
- 집회: SMT assembly and through-hole component insertion.
- Testing: 100% AOI testing, IC pre-programming/burning on-line, ICT testing, and function testing as requested.
- Complete Unit Assembly: Including plastics, metal boxes, coils, cables, 등.
- Conformal Coating: Provided.
- OEM/ODM: Welcomed.
Production Capacity
PCB Capacity
- Max. 크기: Varies.
- DIP Capacity: Available.
- Min. Component Size: 0201.
- Min. Pin Space of IC: 0.3mm.
- Min. Space of BGA: 0.3mm.
- Max. Precision of IC Assembly: ±0.03mm.
- SMT Capacity: ≥2 million points/day.
- DIP Capacity: ≥100k parts/day.
EMS Capacity
- Electronic Product Final Assembly: 100k/month.
Why Choose Us?
고품질
As an ISO9001 certified company, we have a robust quality system and professional quality team.
Reliable Supply Chain
We have established long-term strategic cooperation with top electronic components manufacturers worldwide, such as Xilinx, TI, 에브넷, and Future. Our PCB can reach a max of 64 레이어, with a minimum placement component size of 0201 and a minimum placement spacing of BGA of 0.3mm. We have complete inspection and testing for PCBA, including SPI, AOI, ICT, FCT, X-RAY, ROHS, and aging.
빠른 응답
We offer fast and open BOM quotations to customers. 와 함께 10 years of cooperation experience with European and North American clients, we can quickly and professionally respond to customer requirements.
One-Stop Service
We professionally offer PCB Assembly (SMT, 담그다, MI, AI), component procurement, product final assembly, 테스트, PCBA 컨포멀 코팅, electronic product design, and peripheral products support. Our factory is located in Shenzhen, and we have warehouses in Hong Kong, 유럽, and North America. We can prepare boards at the warehouse closest to the customer and provide Kanban service according to customer requirements.
