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로저스 RO4350B + FR4 혼합 유전체 RF PCB - 그리고

하이브리드 PCB/

로저스 RO4350B + FR4 혼합 유전체 RF PCB

모델: Rogres ro4350B Hybrid PCB

DK: 3.48

구조: 2Layers rogres ro4350B+2layers Fr4

층: 4Layers PCB

완성된 두께: 1.0mm

유전체 두께: 0.508mm

재료 공동 두께: ½(18μm)HH/HH

완성된 공동 두께: 1/0.5/0.5/1(온스)

표면처리: 이머젼 글로드

애플리케이션: Communication PCB

  • 제품 세부정보

개요

The RO4350B + IT180 Mix Laminate High Frequency PCB is a specialized electronic component designed for high-performance applications in the communication industry. Combining the robustness of traditional FR4 materials with the advanced properties of Rogres RO4350B, this 4-layer PCB offers exceptional electrical performance and reliability.

재료 구성

The PCB is constructed using a unique blend of materials:

  • Core Material: Rogres RO4350B, a high-frequency, low-loss laminate with a dielectric constant (DK) ~의 3.48. This material is known for its stability and low moisture absorption, making it ideal for high-speed digital and microwave applications.
  • Support Layers: Two layers of FR4, a standard fiberglass-reinforced epoxy laminate, provide structural support and cost-effectiveness.

Layer Configuration

The PCB features a 4-layer configuration:

  • Total Thickness: 1.0mm
  • 유전체 두께: 0.508mm for the RO4350B layers
  • 구리 두께: 1/0.5/0.5/1 ounce per square foot (온스), ensuring optimal conductivity and current carrying capacity.

성능 특성

The RO4350B + IT180 Mix Laminate High Frequency PCB offers several key performance benefits:

  • Low Loss: The RO4350B material minimizes signal loss, ensuring clear and accurate transmission over high frequencies.
  • Stable Dielectric Constant: The consistent DK of 3.48 across temperature and humidity changes maintains signal integrity.
  • 높은 신뢰성: The combination of RO4350B and FR4 provides a durable and reliable PCB suitable for demanding applications.

생산 과정

The production of the RO4350B + IT180 Mix Laminate High Frequency PCB involves several precision steps:

  1. 재료 준비: RO4350B and FR4 materials are cut to size and prepared for lamination.
  2. 라미네이션: The layers are bonded together under controlled conditions to ensure uniform thickness and adhesion.
  3. Copper Cladding: Copper foil is applied to the outer layers to form the conductive circuits.
  4. 에칭: Unwanted copper is removed to create the desired circuit patterns.
  5. 도금: An immersion gold finish is applied to the copper surfaces for enhanced conductivity and corrosion resistance.
  6. 최종 조립: Components are mounted, and the PCB is tested to ensure it meets specifications.

응용 시나리오

The RO4350B + IT180 Mix Laminate High Frequency PCB is ideal for a range of communication applications, 포함:

  • Wireless Communication Systems: 기지국, antennas, and other components requiring high-frequency signal transmission.
  • Radar Systems: High-precision radar equipment that relies on low-loss materials for accurate signal detection and processing.
  • Satellite Communications: Equipment that operates in extreme environments and requires reliable, high-speed data transmission.

결론

The RO4350B + IT180 Mix Laminate High Frequency PCB is a versatile and high-performance component suitable for demanding communication applications. Its combination of advanced materials and precision manufacturing ensures reliable performance and long-term durability.

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