The PCB material used by teflon PCB, F4BM is laminated by glass woven cloth, 접착 필름, Teflon resin and polytetrafluoroethylene film, in accordance with scientific formula and strict technological process. This product has certain advantages over the F4B series in electrical performance (a wider range of dielectric constant, lower dielectric loss tangent, increased resistance, and more stable performance).
유전 상수: 2.20 2.55 2.65 3.0
Dimension(mm): 300*250 380*350 440*550 500*500 460*610 600*500 840*840 840*1200 1500*1000
For special dimension,customized laminates is available.
Laminate thickness(mm): 0.25 0.5 0.8 1.0 1.5 2.0 3.0 4.0 5.0 6.0 8.0 10.0 12.0
Teflon PCB is widely used to replace ordinary FR4 board because of its excellent characteristics such as good weather resistance, high insulation, high lubrication, non adhesion and non toxicity. 하지만, compared with ordinary FR4 board, Teflon PCB board is the smallest surface tension in solid materials, does not adhere to any substances, and has very small mechanical properties. Its friction coefficient is only 1 / 5 of that of polyethylene, This is an important feature of perfluorocarbon surface. 게다가, due to the low intermolecular force of fluorine carbon chain, Teflon is not sticky, so it is not easy to adhere to the surface of the substrate in the production process of Teflon PCB.
우리의 장점
1. Quick respond,24 hours online service
2. No MOQ requirement
3. Diverse capabilities
4. Fast turnarounds available
Real Project display:
The dielectric DK is wider, DF 각도의 접선 값이 더 낮습니다., 저항값이 증가한다, 성능이 더 안정적입니다..
RF/Microwave Teflon PCB application
Teflon PCB with radio frequency(RF PCB) PCB 산업 내에서 점점 더 많이 사용되는 기술입니다..
–위의 작업을 수행한 고주파 RF PCB 100 MHz.
–위의 작업이 포함된 전자레인지 PCB 2 GHz 무선 주파수.
Teflon PCB are used in different applications such as remote controls(무선 제어)보안,스마트폰,센서 등.
새로운 기술로 인해 이러한 RF 애플리케이션이 점점 더 많이 활용되고 있습니다..
이를 위해서는 높은 품질 표준에 따라 제조하고 애플리케이션에 따라 올바른 RF 재료를 선택해야 합니다..
다양한 재료의 특성을 아는 것이 중요합니다.. Choosing the right material is perhaps the most critical decision in the production process of the Teflon PCB.