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12레이어 2+N+2 HDI 보드 - 그리고

HDI PCB/

12레이어 2+N+2 HDI 보드

name: Twelve-layer 2+N+2 board

그릇: FR4

레이어: 12엘

재료: 솔라

Plate Thickness: 2.0mm

Copper thickness of inner and outer layers: 1온스

최소 구멍 직경: 0.1mm

표면 처리: 이머젼 골드

선 너비: 0.1mm

Line distance: 0.1mm

BGA pad: 0.15mm

  • 제품 세부정보

General Guidelines

Ground Planes

에이. Ground planes are preferred because of their ability to route signals in a microstrip configuration.

Low Impedance and Low Noise

B. Ground plane based 12-layer PCB with low ground impedance and low noise.

High-Speed Signal Tracing

기음. The middle layer between layers is used as the trace for high-speed signals. Even in adjacent planes, the signal layers must be tightly packed with each other.

Adjacent Layer Placement

디. You must place the plane and signal layers in adjacent layers.

Tight Coupling of Planes

E. The large plan and power planes are tightly coupled together.

Expert Design Team Focus

Signal Layer Adjacent to Plane

  • The signal layer should always be adjacent to the plane.

Power Plane as Return Path

  • The power plane can be used for the return path of the signal.

Tight Coupling of Signal Layers

  • Signal layers should be tightly coupled to their adjacent planes.

Determining Signal Return Portion

  • Determine the return portion of the signal.

이전:

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