F4BMX-1/2 Teflon PCB Overview

F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, lower dielectric loss tangent, increased resistance, and more stable performance. The use of imported woven glass fabric ensures consistency in the properties of the laminate.

F4BMX-1/2 Technical Specifications

모습

Meets the specification requirements for microwave PCB laminates according to national and military standards.

Types

F4BMX217
F4BMX220
F4BMX245
F4BMX255
F4BMX265
F4BMX275
F4BMX285
F4BMX294
F4BMX300

유전 상수

F4BMX217: 2.17
F4BMX220: 2.20
F4BMX245: 2.45
F4BMX255: 2.55
F4BMX265: 2.65
F4BMX275: 2.75
F4BMX285: 2.85
F4BMX294: 2.94
F4BMX300: 3.0

치수 (mm)

Standard dimensions available: 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 15001000, 18001000
Customized dimensions are also available.

두께 및 공차 (mm)

Laminate Thickness	용인
0.25	±0.025
0.5	±0.05
0.8	±0.05
1.0	±0.05
1.5	±0.075
2.0	±0.09
3.0	±0.1
4.0	±0.1
5.0	±0.1
6.0	±0.12
8.0	±0.15
10.0	±0.18
12.0	±0.2

메모: The laminate thickness includes the copper thickness. 특수 치수에 맞게 맞춤형 라미네이트를 사용할 수 있습니다..

기계적 강도

두께(mm)	Maximum Warp	Original Board	Single Side	Double Side
0.25～0.5	0.030	0.050	0.025	0.020
0.8～1.0	0.025	0.030	0.020	0.020
1.5～2.0	0.020	0.025	0.015	0.015
3.0～5.0	0.015	0.020	0.010	0.010

Cutting/Punching Strength:

For thickness <1mm, no burrs after cutting; minimum space between two punching holes is 0.55mm, 박리 없음.
For thickness >1mm, no burrs after cutting; minimum space between two punching holes is 1.10mm, 박리 없음.

박리강도 (for 1oz copper):

Normal state: ≥18N/cm; No bubble or delamination peel strength: ≥15N/cm (in constant humidity and temperature, and kept in molten solder at 260 degree Celsius±2 degree Celsius for 20 초).

Chemical Property

The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.

Electrical Property

이름	Test Condition	Unit	Value
Density	Normal state	g/cm³	2.1～2.35
Moisture Absorption	Dip in distilled water at 20±2°C for 24 hours	%	≤0.08
작동 온도	High-low temperature chamber	degree Celsius	-50°C～+260°C
열전도율		W/m/k	0.3~0.5
CTE	Typical (εr :2.1~2.3)	ppm/°C	엑스: 24(x), 와이: 34(y), 지: 235(z)
CTE	Typical (εr :2.3~2.9)	ppm/°C	엑스: 16(x), 와이: 20(y), 지: 168(z)
CTE	Typical (εr :2.9~3.38)	ppm/°C	엑스: 12(x), 와이: 15(y), 지: 92(z)
Shrinkage Factor	2 hours in boiling water	%	< 0.0002
Surface Resistivity	DC, 500다섯, Normal state	MΩ	≥2*10^5
	Under constant humidity and temperature		≥8*10^4
Volume Resistivity	Normal state	MΩ·cm	≥8*10^6
	Under constant humidity and temperature		≥2*10^5
Surface dielectric strength	Normal state	d=1mm(Kv/mm)	≥1.2
	Under constant humidity and temperature		≥1.1
유전 상수	10GHz, εr	(±2%)	See table below
소산 인자	10GHz tgδ		See table below

Dielectric Constant and Dissipation Factor at 10GHz

유형	유전 상수 (εr)	소산 인자 (tgδ)
F4BMX217	2.17	–
F4BMX220	2.20	–
F4BMX245	2.45	–
F4BMX255	2.55	–
F4BMX265	2.65	–
F4BMX275	2.75	–
F4BMX285	2.85	–
F4BMX294	2.94	–
F4BMX300	3.0	–

UGPCB Products and Services

UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, BGA, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, HDI, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, 전기 도금, 그리고 더. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.

PCB 재료 목록

F4BMX-1/2 Teflon PCB Overview