F4BTME-1/2 Overview and Technical Specifications

Introduction to F4BTME-1/2

F4BTME-1/2 is a laminated material created by combining imported varnished glass cloth with Teflon PCB resin and filler, incorporating a Nano-ceramic membrane. This product adheres to strict scientific formulations and technology processes. It employs low roughness copper foil, offering superior electrical performance compared to the F4BM-2-A series, 향상된 열 방출, and a smaller thermal expansion coefficient. It is stable in PIM and suitable for 4G and 5G communications.

Technical Specifications of F4BTME-1/2

Appearance and Types

The appearance meets the specification requirements for microwave PCB laminates as per National and Military Standards. The available types include:

• F4BTME-1/2 (255)
• F4BTME-1/2 (265)
• F4BTME-1/2 (285)
• F4BTME-1/2 (294)
• F4BTME-1/2 (300)
• F4BTME-1/2 (320)
• F4BTME-1/2 (338)
• F4BTME-1/2 (350)
• F4BTME-1/2 (400)
• F4BTME-1/2 (440)

Dimensions and Thickness Tolerances

• Standard Dimensions: 610460, 600500, 1220914, 12201000, 1500*1000 mm.
• Customized Dimensions: Available upon request.
• Thickness Options: 0.254, 0.508, 0.762, 0.787, 1.016; 1.27, 1.524, 2.0; 3.0; 4.0; 5.0; 6.0; 9.0; 10.0; 12.0 mm.
• 용인: ±0.025 to ±0.2 mm depending on thickness.

기계적 강도

• Cutting/Punching: No burrs after cutting, minimum space between punching holes varies from 0.55mm to 1.10mm without delamination.
• Peel Strength: Normal state ≥16N/cm, no bubbles or delamination under constant humidity and temperature after melting solder at 265°C±2°C for 20 초.
• 열 스트레스 저항: No delamination or blisters after three cycles of solder float at 260°C for 10 초.

Chemical and Electrical Properties

• Chemical Etching: Suitable for PCB chemical etching without altering dielectric properties; sodium treatment or plasma treatment required for through-hole plating.
• 전기적 성능: Includes density, 수분 흡수, 작동 온도 범위, 열전도도, CTE variations, 유전 상수, 소산 인자, PIMD values, and flammability rating (UL 94 다섯-0).

This comprehensive overview and detailed technical specifications provide a thorough understanding of the F4BTME-1/2 laminate’s capabilities and applications, making it an ideal choice for advanced electronic device manufacturing where high-frequency performance and thermal management are critical.