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Rogers SpeedWave 300P ultra substrate
SpeedWave 300P prepreg is a resin PCB material with low dielectric constant and ultra-low loss. It can be used to bond various high frequency PCB materials of Rodgers.
With the increasing demand for flexible design of high-layer PCB in the fields of 5G mmWave radar, 고해상도 77 GHz automotive radar PCB, high reliability and high-speed digital design, Rogers introduced ultra-low loss prepreg SpeedWave 300P.
SpeedWave 300P prepreg offers circuit designers high performance solutions at a high cost. SpeedWave 300P prepreg can be used for bonding various Rogers laminates including XtremeSpeed RO1200, CLTE-MW, and RO4000 series. SpeedWave 300P prepreg has a low dielectric constant of 3.0-3.3 and a low loss factor of 0.0019-0.0022 at 10GHz, and maintains the stability of the properties over a very wide frequency range. Various combinations of open fibre and window glass cloth, as well as resin content, are available to maximize the laminated plan.
Rogers SpeedWave 300P ultra substrate parameter sheet.
SpeedWave 300P prepreg meets the design requirements for multiple lamination of high-rise multilayer radar PCB with excellent reliability. It has excellent thick copper filling and flow capacity to meet the design requirements of thick copper. Low z-axis expansion coefficient ensures the reliability of the through hole and CAF resistance. It has UL-94 V-0 flame retardant grade and is compatible with the improved FR-4 and lead-free processes.
SpeedWave 300P
