TU-872 LK 및 TU-87P LK PCB 재료

개요

TU-872 LK and TU-87P LK are PCB materials with low Dk/Df and high thermal reliability. TU-872 LK는 고성능 변성 에폭시 수지 FR-4를 사용하여 제조되었습니다..

Material Composition and Properties

This PCB material is reinforced with ordinary woven E glass and designed to have a low dielectric constant and low loss factor, making it ideal for high-speed low-loss multilayer PCB and high-frequency multilayer PCB board applications. TU-872 LK PCB material is compatible with environmentally friendly lead-free processes and also with FR-4 processes. 뿐만 아니라, TU-872 LK multilayer PCB material demonstrates excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and enhanced toughness due to compounds forming an allyl network.

업계 승인

TU-872 LK and TU-87P LK have received IPC-4101E Type Designations: /29, /99, /101, /126. They are IPC-4101E/126 Validation Services QPL Certified and have a UL designation of ANSI Grade: FR-4.0. The UL file number is E189572, with a Flammability rating of 94V-0 최대 작동 온도는 130°C입니다..

표준 가용성

TU-872 LK and TU-87P LK are available in thicknesses ranging from 0.002” [0.05mm] 0.062”까지 [1.58mm], in sheet or panel form. Copper Foil Cladding ranges from 1/3 에게 5 oz for built-up and double-sided boards. Prepregs are available in roll or panel form, with Glass Styles including 106, 1080, 3313, 2116, and other prepreg grades available upon request.