UGPCB 로고
F4B-1/2 TEFLON PCB 유리 직물 구리 입은 라미네이트
F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.
기술 사양
모습
The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.
유형
- F4B255
- F4B265
유전 상수
- 2.55
- 2.65
Available Dimensions (mm)
- 300×250, 380×350, 440×550, 500×500, 460×610, 600×500
- 840×840, 1200×1000, 1500×1000
- Custom dimensions are available upon request.
구리 두께
- 0.035μm, 0.018μm
두께 및 공차 (mm)
| Laminate Thickness | 용인 |
|---|---|
| 0.17, 0.25 | ±0.025 |
| 0.5, 0.8, 1.0 | ±0.05 |
| 1.5, 2.0 | ±0.05 |
| 3.0, 4.0, 5.0 | ±0.09 |
The laminate thickness includes the copper thickness. Custom dimensions are available upon request.
기계적 강도
| 두께 (mm) | Maximum Warp | Single Side | Double Side |
|---|---|---|---|
| 0.25～ 0.5 | 0.030 | 0.050 | 0.025 |
| 0.8～ 1.0 | 0.025 | 0.030 | 0.020 |
| 1.5～ 2.0 | 0.020 | 0.025 | 0.015 |
| 3.05.0 | 0.015 | 0.020 | 0.010 |
Cutting/Punching Strength:
- Thickness ≤1mm: 절단 후 버가 없습니다, minimum space between punching holes is 0.55mm, 박리 없음.
- 두께 >1mm: 절단 후 버가 없습니다, minimum space between punching holes is 1.10mm, 박리 없음.
껍질 힘 (1온스 구리)
- Normal State: ≥15N/cm; No bubbles or delamination.
- After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 초).
화학적 성질
These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.
전기적 특성
| 이름 | 테스트 조건 | 단위 | 값 |
|---|---|---|---|
| Density | 상태 | g/cm³ | 2.22.3 |
| Moisture Absorption | Dip in distilled water 20±2°C for 24 시간 | % | ≤0.1 |
| 작동 온도 | 고상 온도 챔버 | ℃ | -50++260 |
| 열전도율 | w/m/k | 0.3 | |
| CTE (typical) | 0～100°C | ppm/°C | x:16, 와이:21 지:186 |
| Shrinkage Factor | 2 hours in boiling water | % | ≤0.0002 |
| 표면 저항 | 500DC에서, 상태 | M·Ω | ≥1*10⁴ |
| 일정한 습도와 온도 | ≥5*10³ | ||
| 부피 저항성 | 상태 | MΩ.cm | ≥1*10⁶ |
| 일정한 습도와 온도 | ≥9*10⁴ | ||
| Pin Resistance | 500VDC, 상태 | MΩ | ≥5*10⁴ |
| 일정한 습도와 온도 | ≥5*102 | ||
| Surface Dielectric Strength | 상태, d=1mm (Kv/mm) | ≥1.2 | |
| 일정한 습도와 온도 | ≥1.1 | ||
| 유전 상수 | 10GHZ, | εr | 2.55/2.65 (± 2%) |
| 소산 인자 | 10GHZ, | tgside | ≤1*10⁻³ |
