UGPCB 로고
F4BK-1/2 Teflon Woven Glass Fabric Copper-Clad Laminates
F4BK-1/2 Teflon woven glass fabric copper-clad laminates is a composite of glass cloth, 폴리 테트라 플루오로 에틸렌 수지 및 폴리 테트라 플루오로 에틸렌, laminated in accordance with scientific formula and strict technological process. This product has certain advantages over the F4B series in terms of electrical performance (더 넓은 범위의 유전 상수).
기술 사양
모습
Meet the specification requirements for the laminate of microwave PCB by National and Military Standards.
유형
- F4BK225
- F4BK265
유전 상수
- 2.25
- 2.65
차원(mm)
- 300*250
- 380*350
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 1200*1000
- 1500*1000 특별한 차원, customized laminates are available.
두께 및 공차(mm)
| Laminate Thickness | 용인 |
|---|---|
| 0.25 | ±0.025 |
| 0.5 | ±0.05 |
| 0.8 | ±0.05 |
| 1.0 | ±0.05 |
| 1.5 | ±0.05 |
| 2.0 | ±0.075 |
| 3.0 | ±0.09 |
| 4.0 | ±0.10 |
| 5.0 | ±0.10 |
The laminate thickness includes the copper thickness. 특별한 차원, customized laminates are available.
기계적 강도
Warp
| 두께(mm) | Maximum Warp |
|---|---|
| 오리지널 보드 | Single side |
| 0.25～ 0.5 | 0.030 |
| 0.8～ 1.0 | 0.025 |
| 1.5～ 2.0 | 0.020 |
| 3.05.0 | 0.015 |
Cutting/Punching Strength
| Thickness1mm | No Burrs After Cutting | Minimum Space Between Two Punching Holes | No Delamination |
|---|---|---|---|
| 0.55mm | |||
| >1mm | 1.10mm |
껍질 힘 (1온스 구리)
- 상태: ≥12N/cm; No bubbles or delamination. Peel strength ≥10N/cm (in constant humidity and temperature, and kept in melting solder at 260°C±2°C for 20 초).
Chemical Property
According to the properties of the laminate, the chemical etching method for PCB can be used. The dielectric properties of the laminate are not changed. The plating through hole can be done but the sodium treatment or the plasma treatment must be used.
Electrical Property
| 이름 | 테스트 조건 | 단위 | 값 |
|---|---|---|---|
| Density | 상태 | g/cm³ | 2.22.3 |
| Moisture Absorption | Dip in distilled water 20±2°C for 24 시간 | % | ≤0.1 |
| 작동 온도 | 고상 온도 챔버 | ℃ | -50°C～+250°C |
| 열전도율 | w/m/k | 0.3 | |
| CTE (typical) | ppm/°C | ||
| εr :2.1~2.3 | 25(x), 34(와이), 240(지) | ||
| εr :2.3~2.9 | 16(x), 21(와이), 186(지) | ||
| Shrinkage Factor | 2 hours in boiling water | % | ≤0.0002 |
| 표면 저항 | M·Ω | ||
| 상태 | ≥3*10^4 | ||
| 일정한 습도와 온도 | ≥8*10^3 | ||
| 부피 저항성 | MΩ · cm | ||
| 상태 | ≥2*10^6 | ||
| 일정한 습도와 온도 | ≥2*10^5 | ||
| Surface Dielectric Strength | d=1mm(Kv/mm) | ||
| 상태 | ≥1.2 | ||
| 일정한 습도와 온도 | ≥1.1 | ||
| 유전 상수 | |||
| 10GHZ | εr | ||
| 2.25,2.65 | |||
| 소산 인자 | tgside | ||
| ≤1.5*10^-3 |
This structured format ensures that each section is clearly defined and logically organized, making it easier to understand the key points and specifications of the F4BK-1/2 Teflon woven glass fabric copper-clad laminates.
