UGPCB 로고
F4BME-2-A TEFLON PCB 유리 직물 구리 입은 라미네이트
F4BME-2-A Teflon PCB glass fabric copper-clad laminates are manufactured using imported woven glass fabric, 테플론 PCB 수지, 및 나노 세라믹 막을 갖는 충전제. This product adheres to scientific formulations and stringent technological processes, utilizing low roughness copper foil. It surpasses the F4BM series in electrical performance and surface insulation resistance stability, boasting a higher intermodulation index than F4BME-1/2.
기술 사양
모습: Meets the specification requirements for microwave PCB laminates according to National and Military Standards.
유형:
- F4BME-2-A255
- F4BME-2-A262
- F4BME-2-A275
- F4BME-2-A285
- F4BME-2-A294
- F4BME-2-A300
치수 (mm):
- 550*440
- 500*500
- 600*500
- 650*500
- 1000*850
- 1100*1000
- 1220*1000
- 1500*1000
Custom dimensions are available upon request.
두께 및 공차 (mm):
| Laminate Thickness | 용인 |
|---|---|
| 0.254 | ±0.025 |
| 0.508 | ±0.05 |
| 0.762 | ±0.05 |
| 0.787 | ±0.05 |
| 1.016 | ±0.05 |
| 1.27 | ±0.05 |
| 1.524 | ±0.05 |
| 2.0 | ±0.075 |
| 3.0 | ±0.09 |
| 4.0 | ± 0.1 |
| 5.0 | ± 0.1 |
| 6.0 | ±0.12 |
| 9.0 | ±0.18 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
기계적 강도:
- 절단/펀칭:
- 두께 <1mm: 절단 후 버가 없습니다; 두 펀칭 구멍 사이의 최소 공간은 0.55mm입니다, 박리 없음.
- 두께 >1mm: 절단 후 버가 없습니다; 두 펀칭 구멍 사이의 최소 공간은 1.10mm입니다, 박리 없음.
- 껍질 힘 (1온스 구리):
- 상태: ≥14N/cm; No bubble or delamination peel strength: ≥12N/cm (under constant humidity and temperature, kept in melting solder at 265°C ±2°C for 20 초).
Chemical Property: The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment.
Electrical Property:
| 이름 | 테스트 조건 | 단위 | 값 |
|---|---|---|---|
| Density | 상태 | g/cm³ | 2.1～2.35 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 시간 | % | ≤0.07 |
| 작동 온도 | 고상 온도 챔버 | ℃ | -50°C～+260°C |
| 열전도율 | w/m/k | 0.45~0.55 | |
| CTE (typical) | -55～288°C (εr :2.5~2.9) | ppm/°C | 엑스: 16, 와이: 20, 지: 170 |
| CTE (typical) | -55～288°C (εr :2.9~3.0) | ppm/°C | 엑스: 12 와이: 15 지: 90 |
| Shrinkage Factor | 2 hours in boiling water | % | <0.0002 |
| 표면 저항 | DC, 500다섯, 상태 | MΩ | ≥4*10^5 |
| 부피 저항성 | 상태 | MΩ · cm | ≥6*10^6 |
| 표면 유전체 강도 | d=1mm(Kv/mm) | ≥1.2 | |
| 유전 상수 | 10GHz | See table below | |
| 소산 인자 | 10GHz | See table below | |
| PIMD (2.5GHz) | db | -160 |
UL 가연성 등급: 94 다섯-0
For more information or to place an order, please visit our website www.ugpcb.com or contact us via email at sales@ipcb.com.
UGPCB 제품:
UGPCB offers a wide range of products including:
- Radio/Microwave/Hybrid High Frequency FR4 Double/Multi-Layer 1~3+N+3 HDI, Anylayer HDI, 리지드 플렉스, Blind Buried Slotted, Backdrilled IC Heavy Copper Board, 그리고 더.
If you have any questions or need further assistance, please do not hesitate to contact us through our website or send an inquiry directly to sales@ugpcb.com.
