UGPCB 로고
F4BMX-1/2 TEFLON PCB 개요
F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, 하위 유전 손실 탄젠트, 저항 증가, 더 안정적인 성능. The use of imported woven glass fabric ensures consistency in the properties of the laminate.
F4BMX-1/2 Technical Specifications
모습
Meets the specification requirements for microwave PCB laminates according to national and military standards.
유형
- F4BMX217
- F4BMX220
- F4BMX245
- F4BMX255
- F4BMX265
- F4BMX275
- F4BMX285
- F4BMX294
- F4BMX300
유전 상수
- F4BMX217: 2.17
- F4BMX220: 2.20
- F4BMX245: 2.45
- F4BMX255: 2.55
- F4BMX265: 2.65
- F4BMX275: 2.75
- F4BMX285: 2.85
- F4BMX294: 2.94
- F4BMX300: 3.0
치수 (mm)
- Standard dimensions available: 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 15001000, 18001000
- Customized dimensions are also available.
두께 및 공차 (mm)
| Laminate Thickness | 용인 |
|---|---|
| 0.25 | ±0.025 |
| 0.5 | ±0.05 |
| 0.8 | ±0.05 |
| 1.0 | ±0.05 |
| 1.5 | ±0.075 |
| 2.0 | ±0.09 |
| 3.0 | ± 0.1 |
| 4.0 | ± 0.1 |
| 5.0 | ± 0.1 |
| 6.0 | ±0.12 |
| 8.0 | ±0.15 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
메모: The laminate thickness includes the copper thickness. 특수 치수에 맞게 맞춤형 라미네이트를 사용할 수 있습니다..
기계적 강도
| 두께(mm) | Maximum Warp | Original Board | Single Side | Double Side |
|---|---|---|---|---|
| 0.25～ 0.5 | 0.030 | 0.050 | 0.025 | 0.020 |
| 0.8～ 1.0 | 0.025 | 0.030 | 0.020 | 0.020 |
| 1.5～ 2.0 | 0.020 | 0.025 | 0.015 | 0.015 |
| 3.05.0 | 0.015 | 0.020 | 0.010 | 0.010 |
Cutting/Punching Strength:
- For thickness <1mm, 절단 후 버가 없습니다; 두 펀칭 구멍 사이의 최소 공간은 0.55mm입니다, 박리 없음.
- For thickness >1mm, 절단 후 버가 없습니다; 두 펀칭 구멍 사이의 최소 공간은 1.10mm입니다, 박리 없음.
박리강도 (for 1oz copper):
- 상태: ≥18n/cm; No bubble or delamination peel strength: ≥15N/cm (in constant humidity and temperature, and kept in molten solder at 260 섭씨 ± 2도 섭씨 20 초).
Chemical Property
The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.
Electrical Property
| 이름 | 테스트 조건 | 단위 | 값 |
|---|---|---|---|
| Density | 상태 | g/cm³ | 2.1～2.35 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 시간 | % | ≤0.08 |
| 작동 온도 | 고상 온도 챔버 | 섭씨온도 | -50°C～+260°C |
| 열전도율 | w/m/k | 0.3~0.5 | |
| CTE | Typical (εr :2.1~2.3) | ppm/°C | 엑스: 24(x), 와이: 34(와이), 지: 235(지) |
| CTE | Typical (εr :2.3~2.9) | ppm/°C | 엑스: 16(x), 와이: 20(와이), 지: 168(지) |
| CTE | Typical (εr :2.9~3.38) | ppm/°C | 엑스: 12(x), 와이: 15(와이), 지: 92(지) |
| Shrinkage Factor | 2 hours in boiling water | % | < 0.0002 |
| 표면 저항 | DC, 500다섯, 상태 | MΩ | ≥2*10^5 |
| Under constant humidity and temperature | ≥8*10^4 | ||
| 부피 저항성 | 상태 | MΩ · cm | ≥8*10^6 |
| Under constant humidity and temperature | ≥2*10^5 | ||
| 표면 유전체 강도 | 상태 | d=1mm(Kv/mm) | ≥1.2 |
| Under constant humidity and temperature | ≥1.1 | ||
| 유전 상수 | 10GHz, εr | (± 2%) | See table below |
| 소산 인자 | 10GHz tgδ | See table below |
Dielectric Constant and Dissipation Factor at 10GHz
| 유형 | 유전 상수 (εr) | 소산 인자 (tgside) |
|---|---|---|
| F4BMX217 | 2.17 | – |
| F4BMX220 | 2.20 | – |
| F4BMX245 | 2.45 | – |
| F4BMX255 | 2.55 | – |
| F4BMX265 | 2.65 | – |
| F4BMX275 | 2.75 | – |
| F4BMX285 | 2.85 | – |
| F4BMX294 | 2.94 | – |
| F4BMX300 | 3.0 | – |
UGPCB Products and Services
UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, BGA, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, HDI, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, 전기 도금, 그리고 더. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.
