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Electronic Device Through Hole PCB Assembly - UG

PCB Assembly/

Electronic Device Through Hole PCB Assembly

Name: Electronic Device Through Hole PCB Assembly

Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers

Copper Thickness: 1/3OZ- 6OZ

Plate thickness: 0.21-6.0mm

minute. Hole size: 0.20mm

minute. Line width: 4 million

minute. Line spacing: 0.075 mm

Surface treatment: spray tin/gold drill/OSP/lead-free spray tin

Board size: minimum 10*15mm, maximum 508*889mm

Product Type: OEM&ODM

PCB standard: IPC-A-610 D/IPC-III standard

  • Product Details

Definition and Components

Electronic equipment refers to equipment that is composed of electronic components such as integrated circuits, transistors, and electronic tubes, and uses electronic technology (including software) to function. This includes electronic computers, robots, numerical control or program-controlled systems controlled by electronic computers. It is essentially electrical equipment composed of microelectronic devices. Examples include computers, air conditioners, refrigerators, washing machines, microwave ovens, printers, fax machines, all-in-one machines, etc.

Related Introduction: Integrated Circuits

What is an Integrated Circuit?

An integrated circuit (IC) is a tiny electronic device or component. Using a specific process, the transistors, diodes, resistors, capacitors, inductors, and other components required in a circuit are interconnected and fabricated on a small or several small semiconductor wafers or dielectric substrates. Once packaged, it becomes a microstructure with the required circuit functions. All components within it are structurally integrated, marking a significant step towards miniaturization, low power consumption, and high reliability.

History of the Integrated Circuit

The inventor of the integrated circuit was Jack Kilby (November 8, 1923 – June 20, 2005).

The Importance of Heat Dissipation in Electronic Equipment

Role of Temperature in Electronic Product Design

As a qualified electronic product designer, in addition to successfully realizing the functions of the product, the product’s stability, working life, and environmental adaptability must also be fully considered. These factors are directly or indirectly related to temperature.

Impact of Chip Temperature on System Performance

With the increasing integration and power density of chips, the temperature of the chip has increasingly become a major obstacle to the stable operation and performance improvement of the system. Data shows that 45% of electronic products are damaged due to excessive temperature-related heat dissipation issues, highlighting the importance of effective electronic heat sink design.

PCB Assembly Services

UGPCB is a professional one-stop PCBA service factory that supports Electronic Device Through Hole PCB Assembly business. We welcome you to place an order.

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