High-speed and high-density PCBA design Name: High-speed and high-density PCBA design Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc. Designable layers: 1-32 layers Minimum line width and line spacing: 3mil Minimum laser aperture: 4mil Minimum mechanical aperture: 8mil Copper foil thickness: 18-175цm (standard: 18цm35цm70цm) Peel strength: 1.25N/mm Minimum punching hole diameter: single side: 0.9mm/35mil Minimum hole diameter: 0.25mm/10mil Aperture tolerance: ≤φ0.8mm±0.05mm Send Inquiry Get instant quote Product Details Definition of High-Speed PCB Design In short, high-speed PCB design is any design where signal integrity begins to be affected by the physical properties of the board. Key Physical Properties Layout Packaging Layer Stacking Interconnects Prev: 14-layer 25G high-speed HDI PCB design Next: 12-layer automotive high-speed backplane design Related Products 24-layer high-density high-speed PCB 12-layer automotive high-speed backplane design 14-layer 25G high-speed HDI PCB design High Speed Server Backplane PCB Design Communication terminal circuit board design 5G communication circuit board design Artificial intelligence circuit board design High Frequency High Speed PCB Design Hot Products 12L 3+N+3 HDI board Rogers RO3010 for Guided wave radar level gauge Medical device control PCBA Teflon high-frequency PCB Car charging PCBA Radar PCB