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Multilayer Sunken Gold PCB - UG

Multilayer PCB/

Multilayer Sunken Gold PCB

Name: Multilayer Sunken Gold PCB
Type: Rigid PCB
Copper Thickness: 1/3 OZ~6 OZ
Application: Electronics
Packaging: Vacuum Packaging
Quality Certification: ISO9001, ISO14001, TS16949, RoHS

  • Product Details

What is ENIG PCB?
ENIG (Electroless Nickel Immersion Gold), also known as gold immersion (AU), electroless Ni/AU, or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs) to prevent copper oxidation and improve touch and through-hole plating.

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