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Six-layer HDI PCBA design and production

Six-layer HDI PCBA design and production

Name: TG180 High Density Interconnector PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

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  • Product Details

6-Layer HDI Rigid Flex PCB with Blind and Buried Vias

Material Composition

Rigid Insulating Materials

  • FR4
  • DuPont Polyimide (with good flexural properties)

Rigid Area Thickness

  • 0.6mm (provides good strength to the board)

Laminate Sources

  • All laminates sourced from authorized dealers under XPCB inspection

Surface Finish

ENIG Finish

  • Advantages:
    • Excellent surface flatness
    • Good oxidation resistance
    • Suitability for movable contacts

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