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10-layer 1+N+1 HDI communication PCB - e

PCB HDI/

10-layer 1+N+1 HDI communication PCB

Nome: 10-layer 1-stage HDI communication PCB

Camadas: 1+8+1

Folha: FR4 Tg170

Espessura da placa: 1.2milímetros

Tamanho do painel: 110.8*94.8mm/4

Espessura externa do cobre: 35μm

Espessura da camada interna de cobre: 18μm

Furo passante mínimo: 0.20milímetros

Minimum blind hole: 0.10milímetros

BGA mínimo: 0.20milímetros

Line width and line spacing: 2.5/2.2mil

  • Detalhes do produto

Technical Features

Impedance Specifications

  • 50 Ω Antenna
  • 90Ω & 100Ω Differential Impedance

Applications

Eletrônicos de consumo

  • Cell Phones
  • Tablets
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

Other Applications

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile phones
  • Touch screen devices
  • Laptops
  • Digital cameras
  • 4G network communications

Adicionalmente, HDI PCB technology plays a crucial role in:

  • Medical equipment
  • Various electronic aircraft components

The possibilities for high-density interconnect PCB technology seem almost limitless, offering significant advantages in terms of size, weight, and electrical performance across a wide range of applications.

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