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10-layer 3+N+3 HDI PCB - UGPCB

PCB HDI/

10-layer 3+N+3 HDI PCB

Nome: 10-layer 3-stage HDI PCB

Camadas: 3+N+3

Folha: FR4 Tg170

Espessura da placa: 1.2milímetros

Tamanho do painel: 126*118mm/4

Espessura externa do cobre: 35μm

Espessura da camada interna de cobre: 18μm

Furo passante mínimo: 0.20milímetros

Minimum blind hole: 0.10milímetros

BGA mínimo: 0.25milímetros

Line width and spacing: 2.8/3.2mil

  • Detalhes do produto

Technical Features and Applications of HDI PCBs

Impedance Specifications

  • 50 Ω Antenna
  • 90Ω & 100Ω Differential Impedance

Aplicações

Eletrônicos de consumo

  • Cell Phones
  • Tablets
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

High-Density Interconnect (IDH) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile Phones
  • Touch Screen Devices
  • Laptops
  • Digital Cameras
  • 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

  • Medical Equipment
  • Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.

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