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8-layer 2+N+2 HDI PCBA design - e

Projeto de PCB HDI/

8-layer 2+N+2 HDI PCBA design

Nome: 8-layer second-order HDI PCBA design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc..

Designable layers: 1-32 camadas

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Força de casca: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Largura mínima da linha: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, verde, etc..

Tratamento de superfície: lead/lead-free tin spray, CONCORDAR, silver, OSP

Serviço: Provide OEM service

Certificate: ISO9001.ROSH.UL

  • Detalhes do produto

Increase Routing Density in Complex Designs

Sheet Capability

Lower Dk/Df Material for Better Signal Transmission Performance

Copper Filled Vias

Applications

  • Mobile Phones
  • PDAs
  • UMPCs
  • Portable Game Consoles
  • Digital Cameras
  • Camcorders

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