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High Speed Server Backplane PCB Design - e

Projeto de PCB de alta velocidade/

High Speed Server Backplane PCB Design

Nome: High Speed Server Backplane PCB Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc..

Designable layers: 1-32 camadas

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Força de casca: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

  • Detalhes do produto

Overview of Backplanes

Backplanes are advanced circuit boards that incorporate elements from high-speed design, mechanical design, high-voltage/high-current design, and even RF design.

Applications of Backplanes

Defense Systems

These boards are commonly used in mission-critical defense systems.

Telecommunications Systems

Backplanes are also utilized in telecommunications systems.

Data Centers

Adicionalmente, they play a crucial role in data centers.

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