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Lightwave Communications PCB Board - e

PCB híbrido/

Lightwave Communications PCB Board

Nome: Lightwave Communications PCB Board

Camadas: 6eu

material: TU872+R4350B

Board Thicknes: 1.8 milímetros

Copper Thicknes: 35/35/35/35um

Smallest Hole Diameter: 0.20milímetros

Tratamento de superfície: CONCORDAR(2U'')

Technical Feature: Vacuum Plugging, Cego enterrado via

Applications

Ground receiving equipment

  • Detalhes do produto

Importance of High-Speed Circuits

High-speed circuits are essential to increase the bandwidth for transmitting and switching voice/video/data over fiber optic networks. Due to the explosion in Internet traffic, the growing demand for bit rates has driven engineers to develop integrated circuits with performance approaching 100 Gb/s.

Availability of High-Speed Circuits

Commercial lightwave products using high-speed circuits of 10 Gb/s and higher are readily available.

Content of the BookHigh-Speed Circuits for Lightwave Communication

Latest Information on Circuit Design

High-Speed Circuits for Lightwave Communication provides the latest information on circuit design.

Measurement Results and Applications

It also covers measurement results and applications.

Product Development

The book includes details on product development.

Coverage of Electronic and Optoelectronic Circuits

The book covers electronic and optoelectronic circuits for transmission, reception, and crosspoint switching.

State-of-the-Art IC Technologies

These circuits are implemented using a variety of state-of-the-art IC technologies, including:

Si BJT

  • Silicon Bipolar Junction Transistor (Si BJT)

GaAs MESFET

  • Gallium Arsenide Metal-Semiconductor Field-Effect Transistor (GaAs MESFET)

HEMT

  • High Electron Mobility Transistor (HEMT)

HBT

  • Heterojunction Bipolar Transistor (HBT)

InP HEMT and HBT

  • Indium Phosphide-based HEMT and HBT

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