P2.9 led printed circuit board

Overview of the P2.9 LED Printed Circuit Board

The P2.9 LED Printed Circuit Board (PCB) is a specialized PCB designed for use with P2.9 LED modules, which are commonly used in high-resolution display applications. This PCB is ideal for creating large, seamless LED displays.

What is a P2.9 LED Printed Circuit Board?

A P2.9 LED Printed Circuit Board is a printed circuit board (PCB) specifically designed to accommodate and connect P2.9 LED modules. The term “P2.9” refers to the pixel pitch of the LED module, which measures 2.9 millimeters between each pixel. This PCB ensures that the LED modules can be interconnected efficiently, providing a stable platform for the electronic components.

Design Requirements

The design requirements for a P2.9 LED Printed Circuit Board are stringent to ensure its performance and reliability:

Material: SY1000-2 TG170 FR4, chosen for its excellent electrical and thermal properties.
Contagem de camadas: 6 layers to accommodate the necessary circuitry and signal integrity.
Cor: Black/White for easy identification and aesthetic appeal.
Espessura Acabada: 1.0mm to provide structural integrity and durability.
Espessura do Cobre: 1OZ to ensure adequate conductivity and heat dissipation.
Tratamento de superfície: Immersion Gold to enhance solderability and corrosion resistance.
Minimum Trace and Space: 4mil(0.1milímetros) to support fine circuit patterns.
Characteristic: More pads with small spacing to accommodate the dense layout of P2.9 LED modules.

How Does It Work?

The P2.9 LED Printed Circuit Board works by providing a platform for various electronic components to be interconnected through conductive pathways. These pathways, or traces, are made of copper and are etched onto the board. The SY1000-2 TG170 FR4 material ensures that the PCB can withstand the demands of LED display applications, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

Applications

The primary application of the P2.9 LED Printed Circuit Board is in high-resolution LED display systems where it manages and regulates the flow of electrical signals. This includes:

Indoor and outdoor LED displays
Digital signage
Large format video walls
Event stages and concert screens

Classification

Based on its features and applications, the P2.9 LED Printed Circuit Board can be classified as a high-density, high-speed digital PCB designed for LED display applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

Material Composition

The core material used in the P2.9 LED Printed Circuit Board is SY1000-2 TG170 FR4, a high-performance composite material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of LED display applications.

Performance Characteristics

The performance characteristics of the P2.9 LED Printed Circuit Board include:

High signal integrity
Low signal loss
Superior thermal management
Robust mechanical strength
Long-term stability

Structural Details

The structural details of the P2.9 LED Printed Circuit Board are as follows:

Contagem de camadas: 6 camadas
Espessura Acabada: 1.0milímetros
Espessura do Cobre: 1OZ
Tratamento de superfície: Imersão Ouro
Minimum Trace and Space: 4mil(0.1milímetros)
Characteristic: More pads with small spacing to accommodate the dense layout of P2.9 LED modules.

Features and Benefits

The key features and benefits of the P2.9 LED Printed Circuit Board include:

High density interconnectivity
Excellent signal integrity
Robust mechanical construction
Reliable long-term performance
Aesthetic color options (Black/White)

Production Process

The production process of the P2.9 LED Printed Circuit Board involves several steps including:

Material Selection: Choosing high-quality SY1000-2 TG170 FR4 material.
Layer Stacking: Arranging the 6 layers with precision.
Etching: Removing excess copper to form the desired trace patterns.
Solder Mask Application: Applying a solder mask layer to protect the copper traces.
Plating: Applying immersion gold surface treatment.
Assembly: Incorporating PTHs and vias for layer interconnections.
Testing: Ensuring the PCB meets all performance specifications.