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Doosan DS-7409 HG (KQ) IC Package substrate material - e

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Doosan DS-7409 HG (KQ) IC Package substrate material

Introduction

UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.

Glass Epoxy Laminates in Industrial Equipment

Glass Epoxy Laminates, which are widely used in industrial equipment, have been further refined and are helping to promote sustainable economic growth in an environmentally-friendly way in accordance with ongoing changes in our lifestyle. They are the basis on which numerous environmentally-friendly products, including mobile applications, computer systems, and car electronics, have been developed and produced.

DS-7409 Variants

DS-7409
DS-7409S (N)

Material Properties of DS-7409

Tg (Glass Transition Temperature)

Property: Tg
Unidade: degree Celsius
Test Condition: DSC
Typical Value: 170
Test Method: IPC-TM-650.2.4.25c

TMA (Thermomechanical Analysis)

Property: TMA
Unidade: degree Celsius
Test Condition: N/A
Typical Value: 165
Test Method: IPC-TM-650.2.4.24c

CTE Z-axis (Coeficiente de Expansão Térmica)

Property: CTE Z-axis
Unidade: ppm/degree Celsius
Test Condition: Ambient to Tg
Typical Value: 41
Test Method: IPC-TM-650.2.4.41

Z-axis Expansion

Property: Z-axis Expansion
Unidade: %
Test Condition: 50 degree Celsius to 260 degree Celsius
Typical Value: 3.3
Test Method: IPC-TM-650.2.4.41

Decomposition Temperature (5% wt loss)

Property: Decomposition Temperature
Unidade: degree Celsius
Test Condition: TGA
Typical Value: 295
Test Method: IPC-TM-650.2.4.40

T-260 & T-288 (Thermomechanical Analysis)

Property: T-260
Unidade: min
Test Condition: TMA
Typical Value: 7
Test Method: IPC-TM-650.2.4.24.1

Property: T-288
Unidade: min
Test Condition: TMA
Typical Value: –
Test Method: IPC-TM-650.2.4.24.1

Constante dielétrica & Dissipation Factor

Property: Constante dielétrica (Resin content 50%)
Unidade: C-24/23/50(1GHz)
Test Condition: N/A
Typical Value: 4.2
Test Method: IPC-TM-650.2.5.5.9

Property: Dissipation Factor (Resin content 50%)
Unidade: C-24/23/50(1GHz)
Test Condition: N/A
Typical Value: 0.015
Test Method: IPC-TM-650.2.5.5.9

Peel Strength

Property: Peel Strength (Standard profile 1oz)
Unidade: N/mm
Test Condition: Condition A
Typical Value: 2.0
Test Method: IPC-TM-650.2.4.8

Water Absorption

Property: Water Absorption
Unidade: %
Test Condition: E-24/50+D-24/23
Typical Value: 0.12
Test Method: IPC-TM-650.2.6.2.1

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