LOGOTIPO UGPCB
Characteristics of SI10U
SI10U is characterized by its low coefficient of thermal expansion (CTE) and high modulus, which can effectively reduce the warpage of packaging substrates. It also boasts excellent heat and humidity resistance, good PCB processability, and is made from halogen-free materials.
Application Areas for SI10U
The application areas for SI10U include eMMC, DRAM, AP, PA, Dual CM, Fingerprint, and RF Module.
Specifications of SI10U
| Items | Conditions | Unidade | SI10U(S) |
|---|---|---|---|
| Tg | DMA | degree Celsius | 280 |
| Td | 5% wt. perda | degree Celsius | >400 |
| CTE (X/Y-axis) | Before Tg | ppm/degree Celsius | 10 |
| CTE (Z-axis) | α1/α2 | ppm/degree Celsius | 25/135 |
| Constante dielétrica (1GHz) | – | – | 2.5.5.9 |
| Dissipation Factor (1GHz) | – | – | 2.5.5.9 |
| Peel Strength | 1/3 OZ, VLP Cu | N/mm | 0.80 |
| Solder Dipping | @288 degree Celsius | min | >=30 |
| Young’s Modulus | 50 degree Celsius | GPa | 26 |
| Young’s Modulus | 200 degree Celsius | GPa | 23 |
| Flexural Modulus (50 degree Celsius) | GPa | 32 | |
| Flexural Modulus (200 degree Celsius) | GPa | 27 | |
| Water Absorption (UM) | % | 0.14 | |
| Water Absorption (85 degree Celsius/85%RH,168Hr) | % | 0.35 | |
| Flammability | UL-94 Rating | V-0 | |
| Thermal Conductivity | W/(m.K) | 0.61 | |
| Cor | – | Preto |
Production Capabilities
UGPCB company has matured to use SI10U to produce IC Substrate boards in batches.
