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Plasma Nano-Protection (PECVD) Principle
Plasma nano-protection (PECVD) is a method that utilizes plasma-enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition) technology to achieve nanoscale protection. The PECVD technique ionizes gases containing thin film constituent atoms through microwave or radio frequency methods, forming plasma locally. Due to the high chemical reactivity of the plasma, reactions occur easily, allowing for the deposition of nanoscale films with dustproof, waterproof, and anticorrosive functions on PCBs or PCBAs.
PECVD Application Scenarios
PECVD technology can be used to prepare various thin film materials, such as silicon nitride films, silicon carbide films, zinc oxide films, etc. These thin film materials have important application value in photoelectronic devices, microelectronic devices and sensors. By controlling the deposition conditions and precursor concentration, PECVD technology can form a nano-level coating on the surface of protected electronic devices such as PCB or PCBA. This coating may have excellent protective performance, such as waterproof, antifouling, anticorrosion, antibacterial, and antioxidant properties. This coating can also be used for protection of various outdoor equipment, medical devices, etc.
UGPCB, după dezvoltarea pe termen lung, nu numai că are un design de vârf PCB și PCBA, prototipare, și capacități de producție, dar are, de asemenea, o afacere de top în domeniul nanoprotecției cu plasmă PECVD, furnizarea de servicii de nanoprotecție cu plasmă pe termen lung pentru produsele de plăci de circuite pentru companie și pentru alți producători de PCB sau PCBA.
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