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14-layer 25G high-speed HDI PCB design - UGPCB

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14-layer 25G high-speed HDI PCB design

14-layer 25G high-speed HDI PCB design

Nume: 14-layer 25G high-speed HDI PCB design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 straturi

Lățimea minimă a liniei și distanțarea liniei: 3mil

Deschidere minimă laser: 4mil

Deschidere mecanică minimă: 8mil

Grosimea foliei de cupru: 18-175cm (standard: 18CM35CM70cm)

Coajă de rezistență: 1.25N/mm

Diametrul gaurei minime de perforare: o singură parte: 0.9mm/35mil

Diametrul minim al găurii: 0.25mm/10mil

Toleranță la deschidere: ≤φ0.8mm ± 0,05mm

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Detalii despre produs

High Performance Characteristics

High Insulation Reliability and Micro-Via Reliability

High insulation reliability and micro-via reliability;

High Glass Transition Temperature (TG)

High glass transition temperature (TG);

Low Dielectric Constant and Low Water Absorption

Low dielectric constant and low water absorption;

High Adhesion and Strength to Copper Foil

High adhesion and strength to copper foil;

Uniform Insulating Layer Thickness

The thickness of the insulating layer after curing is uniform.

Additional Advantages

At the same time, since RCC is a new product without glass fiber, it is conducive to laser and plasma etching processing, and is conducive to lightweight and thin multi-layer circuit boards. În plus, there are 12μm, 18μm, and other thin copper clad laminates, which are easy to process.