LOGO UGPCB
High Performance Characteristics
High Insulation Reliability and Micro-Via Reliability
High insulation reliability and micro-via reliability;
High Glass Transition Temperature (Tg)
High glass transition temperature (Tg);
Low Dielectric Constant and Low Water Absorption
Low dielectric constant and low water absorption;
High Adhesion and Strength to Copper Foil
High adhesion and strength to copper foil;
Uniform Insulating Layer Thickness
The thickness of the insulating layer after curing is uniform.
Additional Advantages
At the same time, since RCC is a new product without glass fiber, it is conducive to laser and plasma etching processing, and is conducive to lightweight and thin multi-layer circuit boards. In addition, there are 12μm, 18μm, and other thin copper clad laminates, which are easy to process.
