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High-speed and high-density PCBA design

High-speed and high-density PCBA design

High-speed and high-density PCBA design

Nume: High-speed and high-density PCBA design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

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Product Details

Definition of High-Speed PCB Design

In short, high-speed PCB design is any design where signal integrity begins to be affected by the physical properties of the board.

Key Physical Properties

Layout
Packaging
Layer Stacking
Interconnects

Prev: 14-layer 25G high-speed HDI PCB design

Următorul: 12-layer automotive high-speed backplane design

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