LOGO UGPCB
Introduction
UGPCB DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications include Flip chip BoC & RF module.
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DS-7409 Variants
DS-7409
DS-7409S (N)
Material Properties of DS-7409
TG (Temperatura de tranziție a sticlei)
Property: TG
Unitate: grad Celsius
Test Condition: DSC
Valoare tipică: 170
Test Method: IPC-TM-650.2.4.25c
TMA (Thermomechanical Analysis)
Property: TMA
Unitate: grad Celsius
Test Condition: N/A
Valoare tipică: 165
Test Method: IPC-TM-650.2.4.24c
CTE Z-axis (Coeficient de expansiune termică)
Property: CTE Z-axis
Unitate: ppm/degree Celsius
Test Condition: Ambient to Tg
Valoare tipică: 41
Test Method: IPC-TM-650.2.4.41
Z-axis Expansion
Property: Z-axis Expansion
Unitate: %
Test Condition: 50 grad Celsius la 260 grad Celsius
Valoare tipică: 3.3
Test Method: IPC-TM-650.2.4.41
Decomposition Temperature (5% wt loss)
Property: Decomposition Temperature
Unitate: grad Celsius
Test Condition: TGA
Valoare tipică: 295
Test Method: IPC-TM-650.2.4.40
T-260 & T-288 (Thermomechanical Analysis)
Property: T-260
Unitate: min
Test Condition: TMA
Valoare tipică: 7
Test Method: IPC-TM-650.2.4.24.1
Property: T-288
Unitate: min
Test Condition: TMA
Valoare tipică: –
Test Method: IPC-TM-650.2.4.24.1
Dielectric Constant & Factor de disipare
Property: Dielectric Constant (Resin content 50%)
Unitate: C-24/23/50(1GHz)
Test Condition: N/A
Valoare tipică: 4.2
Test Method: IPC-TM-650.2.5.5.9
Property: Factor de disipare (Resin content 50%)
Unitate: C-24/23/50(1GHz)
Test Condition: N/A
Valoare tipică: 0.015
Test Method: IPC-TM-650.2.5.5.9
Coajă de rezistență
Property: Coajă de rezistență (Standard profile 1oz)
Unitate: N/mm
Test Condition: Condition A
Valoare tipică: 2.0
Test Method: IPC-TM-650.2.4.8
Absorbția apei
Property: Absorbția apei
Unitate: %
Test Condition: E-24/50+D-24/23
Valoare tipică: 0.12
Test Method: IPC-TM-650.2.6.2.1
