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Microwave dielectric copper-clad substrate TP-1/2 - UGPCB

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Microwave dielectric copper-clad substrate TP-1/2

Microwave Circuit Design Advantages Using TP-1/2

Stable Dielectric Constant and Operating Temperature

The dielectric constant of TP-1/2 is stable and can be customized within the range of 3.0 to 22.0, depending on the specific requirements of the circuit design. The operating temperature ranges from -100 degrees Celsius to +150 grade Celsius.

Reliable Peel Strength and Lower Manufacturing Costs

TP-1/2 offers a more reliable peel strength between copper and the substrate compared to vacuum film coating on ceramic substrates. This makes it easier for customers to process circuits with higher pass rates and significantly lower manufacturing costs than ceramic substrates.

Low Dissipation Factor and Mechanical Manufacturability

TP-1/2 has a dissipation factor (tgδ) of ≤1*10^-3, with minimal variation as frequency increases. It is also easily machinable through processes such as drilling, punching, grinding, cutting, and etching, which are not possible with ceramic substrates.

Technical Specifications of TP-1/2

Appearance

Smooth and neat on both sides: no stains, scratches, or dents.

Dimension and Tolerance

  • Dimensions (A*B in mm): 120100, 150150, 160160, 180180, 200200, 170240
  • Tolerance: -2
  • Thickness and Tolerance: 0.8±0.05, 1.0±0.05, 1.2±0.05, 1.5±0.06, 2.0±0.075, 3.0±0.10, 4.0±0.10, 5.0±0.12, 6.0±0.12, 10.0±0.2
  • Customized Lamination: Available for special dimensions.

Mechanical Strength

  • Coajă de rezistență:
    • Normal state: ≥6N/cm
    • In alternating humidity and temperature: ≥4 N/cm

Chemical Property

The chemical etching method used for PCB can be applied without altering the dielectric properties of the materials.

Electrical Property

Nume Test Condition Unitate Value
Density Normal state g/cm³ 1.0~2.9
Moisture Absorption Dip in distilled water at 20±2°C for 24 ore % ≤0.02
Operating Temperature High-low temperature chamber ° C. -100~+150
Thermal Conductivity -55~288°C W/m/k 0.6
Cte Temperature rise of 96°C per hour ppm/°C ≤6*10^-5
Shrinkage Factor 2 hours in boiling water % 0.0004
Rezistivitatea suprafeței 500V DC, normal state ≥1*10^7
Rezistivitatea volumului Normal state MΩ · cm ≥1*10^9
Pin Resistance 500V DC, normal state ≥1*10^6
Surface Dielectric Strength Normal state Kv/mm ≥1.5
Dielectric Constant 10GHZ εr 3,6,9.6,10.2,10.5,11,16,20,22(±2%) (customizable)
Factor de disipare 10GHZ Tgδ(εr 3-11) ≤1*10^-3
Factor de disipare Tgδ(εr 12-22) ≤1.5*10^-3

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