и,печатная плата, Настройка PCBA и PECVD, производитель прототипов и производства

Скачать | О | Контакт | Карта сайта

12-layer automotive high-speed backplane design

Имя: 12-layer automotive high-speed backplane design

Plate: TG170 /TG180, F4BM, ФР4, FR1-4, и т. д..

Designable layers: 1-32 слои

Minimum line width and line spacing: 3мил

Minimum laser aperture: 4мил

Minimum mechanical aperture: 8мил

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

  • Подробная информация о продукте

Size and Space Savings

  • Small size provides significant space savings.

Modularity and Flexibility

  • Modular design provides application flexibility.

High Performance

  • High performance system.

High-Density Backplane System

  • High-density backplane system – до 84 differential pairs per linear inch.

Post Spacing

  • 1.80 mm post spacing.

Design Configurations

  • 3 Pair, 4 Pair, и 6 Pair Designs.
  • 4, 6, или 8 columns.
  • 12 – 48 pairs.

Signal/Ground Pin Options

  • Multiple signal/ground pin classification options.

Integrated Components

  • Provides integrated power, boot, keying, and sidewalls.

Impedance Options

  • 85 Ω and 100 Ω options.

Hot Swap Capability

  • Three-level sorting supports hot swap.

Cost-Effectiveness

  • Cost-effective design for low-speed applications.

Предыдущий:

Следующий:

Оставить ответ

Оставить сообщение