и,печатная плата, Настройка PCBA и PECVD, производитель прототипов и производства

Скачать | О | Контакт | Карта сайта

36layers high tg backplane pcb - и

Специальная печатная плата/

36layers high tg backplane pcb

Модель : 36layers high tg backplane pcb

Материал : High TG FR4

Слой : 36Слои

Цвет : Зеленый/Белый

Готовая толщина : 2.4мм

Толщина меди : 1ОЗ

Обработка поверхности : Погружение Золото

Минимальная трассировка : 4мил(0.1мм)

Минимальное пространство : 4мил(0.1мм)

characteristic : High multilayer,Panasonic m6 pcb material

Приложение : backplane pcb

  • Подробная информация о продукте

Overview of the 36-Layer High TG Backplane PCB

The 36-Layer High TG Backplane PCB is a high-density, multilayer printed circuit board (печатная плата) designed for backplane applications. This PCB is ideal for complex electronic systems that need to manage high power and signal integrity.

What is a 36-Layer High TG Backplane PCB?

A 36-Layer High TG Backplane PCB is a printed circuit board (печатная плата) with 36 layers of conductive material separated by insulating layers, specifically designed for backplane applications. The termHigh TGrefers to the glass transition temperature, indicating the PCB’s ability to withstand high temperatures without losing its mechanical and electrical properties.

Требования к дизайну

The design requirements for a 36-Layer High TG Backplane PCB are stringent to ensure its performance and reliability:

  • Материал: High TG FR4, chosen for its excellent electrical and thermal properties.
  • Layer Count: 36 layers to accommodate complex and dense circuit designs.
  • Цвет: Green/White for easy identification and aesthetic appeal.
  • Готовая толщина: 2.4mm to provide structural integrity and durability.
  • Толщина меди: 1OZ to ensure adequate conductivity and heat dissipation.
  • Обработка поверхности: Immersion Gold to enhance solderability and corrosion resistance.
  • Minimum Trace and Space: 4мил(0.1мм) to support fine circuit patterns.
  • Characteristic: High multilayer, Panasonic M6 PCB material, known for its high reliability and performance.

How Does It Work?

The 36-Layer High TG Backplane PCB works by providing a platform for various electronic components to be interconnected through conductive pathways. These pathways, or traces, are made of copper and are etched onto the board. The high TG FR4 material ensures that the PCB can withstand high temperatures without losing its mechanical and electrical properties, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

Приложения

The primary application of the 36-Layer High TG Backplane PCB is in backplane applications where it manages and regulates the flow of electrical signals. This includes:

  • Data communication devices
  • Networking equipment
  • Industrial control systems
  • Telecommunication infrastructure

Классификация

Based on its features and applications, the 36-Layer High TG Backplane PCB can be classified as a high-speed digital PCB designed for backplane applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

Material Composition

The core material used in the 36-Layer High TG Backplane PCB is High TG FR4, a high-performance composite material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of backplane applications.

Характеристики производительности

The performance characteristics of the 36-Layer High TG Backplane PCB include:

  • High signal integrity
  • Low signal loss
  • Superior thermal management
  • Robust mechanical strength
  • Long-term stability

Structural Details

The structural details of the 36-Layer High TG Backplane PCB are as follows:

  • Layer Count: 36 слои
  • Готовая толщина: 2.4мм
  • Толщина меди: 1ОЗ
  • Обработка поверхности: Погружение Золото
  • Minimum Trace and Space: 4мил(0.1мм)
  • Characteristic: High multilayer, Panasonic M6 PCB material

Features and Benefits

The key features and benefits of the 36-Layer High TG Backplane PCB include:

  • High density interconnectivity
  • Excellent signal integrity
  • Robust mechanical construction
  • Reliable long-term performance
  • Aesthetic color options (Зеленый/Белый)

Производственный процесс

The production process of the 36-Layer High TG Backplane PCB involves several steps including:

  1. Material Selection: Choosing high-quality High TG FR4 material.
  2. Наложение слоев: Arranging the 36 layers with precision.
  3. Офорт: Removing excess copper to form the desired trace patterns.
  4. Solder Mask Application: Applying a solder mask layer to protect the copper traces.
  5. Покрытие: Applying immersion gold surface treatment.
  6. Сборка: Incorporating PTHs and vias for layer interconnections.
  7. Тестирование: Ensuring the PCB meets all performance specifications.

Варианты использования

The 36-Layer High TG Backplane PCB is used in various scenarios such as:

  • Backplane applications in data centers
  • High-speed networking equipment
  • Industrial automation systems
  • Telecommunication infrastructure
Pages: 1 2

Предыдущий:

Следующий:

Оставить ответ

Оставить сообщение