6L 1+N+1 HDI for Mobile Phone Main board PCB

Product Overview

The 6L 1+N+1 HDI mobile mainboard is a high-density interconnect (ИЧР) печатная плата (печатная плата) designed for use in mobile devices. With its advanced design and construction, this mainboard offers superior performance and reliability for demanding mobile applications.

Определение

HDI stands for High-Density Interconnect, which refers to PCBs that have higher wiring density than traditional PCBs. The “1+N+1” designation indicates the layer structure of the PCB, with one power layer, N signal layers, and one ground layer.

Требования к дизайну

The design of the 6L 1+N+1 HDI mobile mainboard must meet several key requirements:

High signal integrity to support fast data transfer rates
Low crosstalk and interference to ensure reliable communication
Robust mechanical properties to withstand the stresses of daily use
Thermal management to dissipate heat effectively

Принцип работы

The 6L 1+N+1 HDI mobile mainboard operates by connecting various electronic components through a network of conductive pathways. These pathways are created using copper traces on the PCB layers, which are insulated from each other by layers of dielectric material. Electrical signals travel along these traces to perform the device’s functions.

Purpose and Applications

This type of mobile mainboard is commonly used in smartphones, таблетки, and other portable electronic devices where space is limited but performance requirements are high. Its compact size and high functionality make it ideal for modern mobile technology.

Классификация

The 6L 1+N+1 HDI mobile mainboard falls under the category of high-end mobile mainboards due to its advanced features and construction. It is designed specifically for mobile applications requiring high performance and reliability.

Materials Used

The main material used for this mainboard is FR-4, a flame-resistant glass-epoxy laminate composite. This material provides excellent thermal stability and mechanical strength, making it suitable for high-performance mobile applications.

Характеристики производительности

High Signal Integrity: Ensures fast data transfer rates without loss or distortion.
Low Crosstalk: Minimizes interference between adjacent signal traces.
Robust Mechanical Properties: Withstands the physical stresses of daily use.
Effective Thermal Management: Dissipates heat efficiently to prevent overheating.

Structure and Features

Layer Structure: Consists of six layers with a configuration of 1+N+1, where N represents the number of signal layers.
Толщина меди: Inner layers have a thickness of 1 унция (ounce), while outer layers are 0.5 унция.
Обработка поверхности: Immersion gold, which provides excellent solderability and corrosion resistance.
Minimum Trace/Space: Capable of producing fine details with minimum trace widths and spaces of 3 мил.
Hole Types: Mechanically drilled holes as small as 0.2 mm and laser-drilled holes as fine as 0.1 мм.

Производственный процесс

The manufacturing process for the 6L 1+N+1 HDI mobile mainboard involves several stages:

Подготовка материала: Selection of high-quality FR-4 substrates.
Наложение слоев: Arranging the layers in the desired order.
Офорт: Removing excess copper to create the desired circuit pattern.
Покрытие: Applying a thin layer of metal to the exposed copper areas.
Обработка поверхности: Applying immersion gold for enhanced solderability.
Сборка: Mounting components onto the mainboard.
Тестирование: Conducting thorough electrical and functional tests to ensure quality.
Заключительная проверка: Visual and automated optical inspection to check for defects.
Упаковка: Safely packaging the finished product for shipment.

Use Case Scenarios

Бытовая электроника: Смартфоны, таблетки, smartwatches, и т. д..
Wearable Devices: Fitness trackers, health monitors, и т. д..
Автомобильная электроника: In-car entertainment systems, navigation units, и т. д..
Industrial Applications: Control panels, sensor interfaces, и т. д..

In summary, the 6L 1+N+1 HDI mobile mainboard is an advanced PCB designed specifically for high-performance mobile applications. Its robust construction, superior signal integrity, and efficient thermal management make it an ideal choice for modern mobile technology.