Communication high frequency hybrid PCB

Structure and Composition

Base Plate and Layers

The high-frequency hybrid PCB splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.

High-Frequency and Auxiliary Areas

The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.

Design and Features

Division of Areas

The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. This design provides mechanical support.

High-Frequency Materials

The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.

Product Specifications

Classification and Layers

• High Frequency Hybrid Product Classification Layers: 6 Слои

Materials and Dimensions

• Used Board: РО4350Б + ФР4
• Толщина: 1.6мм
• Размер: 210мм * 280мм

Surface Treatment and Applications

• Обработка поверхности: Gold-plated
• Minimum Aperture: 0.25мм
• Приложение: Communication
• Функции: High Frequency Mixed Pressure