6-Layer Golden Finger printed circuit board

Overview of 6 Layer Golden Finger PCB

The 6 Layer Golden Finger PCB is a high-precision, multi-layered printed circuit board designed for advanced electronic applications. This product combines multiple layers of conductive traces and insulating materials to provide exceptional performance and reliability in various electronic devices.

Определение

А 6 Layer Golden Finger PCB is a type of multi-layer printed circuit board (печатная плата) that features six individual layers of conductive material, separated by insulating layers. The term “Golden Finger” refers to the specific surface treatment applied to the edges of the board, which involves immersion gold and additional gold plating on the contact fingers.

Требования к дизайну

When designing a 6 Layer Golden Finger PCB, several key requirements must be considered:

Material Quality: High-quality FR4 material is essential for durability and performance.
Layer Configuration: Six layers are needed to accommodate complex circuitry and signal routing.
Толщина меди: A standard copper thickness of 1OZ ensures adequate conductivity.
Обработка поверхности: Immersion gold with additional gold finger plating enhances connectivity and corrosion resistance.
Trace/Space Dimensions: A minimum trace/space of 4mil/4mil is required for precise circuit patterns.
Special Processes: The gold finger process with a thickness of 0.1um is critical for reliable edge connections.

Принцип работы

The 6 Layer Golden Finger PCB operates based on the principles of electrical conductivity and insulation. Conductive traces on different layers create pathways for electrical signals, while insulating layers prevent unwanted interactions between these signals. The gold finger edges facilitate easy insertion into connectors, ensuring stable and reliable connections.

Приложения

This type of PCB is widely used in applications that require high precision and reliability, такой как:

High-speed digital circuits
Telecommunications equipment
Advanced computing systems
Automotive electronics
Medical devices

Классификация

6 Layer Golden Finger PCBs can be classified based on their intended use, такой как:

Signal Processing Boards: For handling high-frequency signals in communication devices.
Power Distribution Boards: To manage power supply in complex electronic systems.
Control Boards: For controlling and managing various functions in electronic devices.

Материалы

The primary materials used in the construction of a 6 Layer Golden Finger PCB include:

Base Material: ФР4, a flame-retardant fiberglass material known for its excellent dielectric properties and mechanical strength.
Conductive Material: Медь, used for the conductive traces.
Обработка поверхности: Immersion gold and additional gold plating for the gold fingers.

Производительность

The performance of a 6 Layer Golden Finger PCB is characterized by:

High Signal Integrity: Due to precise trace/space dimensions and quality materials.
Reliable Connectivity: Ensured by the gold finger surface treatment.
Durability: Enhanced by the robust FR4 base material and immersion gold finish.
Electrical Efficiency: Minimized signal loss and interference due to optimized layer configuration.

Структура

The structure of a 6 Layer Golden Finger PCB consists of:

Six Layers of Conductive Material: Alternating with insulating layers.
Gold Finger Edges: Plated with a thin layer of gold for enhanced connectivity.
Protective Layers: Including solder mask and silkscreen for protection and identification.

Функции

Key features of the 6 Layer Golden Finger PCB include:

Advanced Surface Treatment: Immersion gold plus gold finger for superior connection quality.
High Precision: With a minimum trace/space of 4mil/4mil.
Customizable Color Options: Available in green or white.
Standard Thickness: With a finished thickness of 1.6mm.

Производственный процесс

The production process for a 6 Layer Golden Finger PCB involves several steps:

Подготовка материала: Selecting and preparing FR4 sheets and copper foil.
Наложение слоев: Alternating layers of copper and insulating materials.
Офорт: Удаление лишней меди для формирования желаемого рисунка схемы..
Покрытие: Applying immersion gold and additional gold finger plating.
Ламинирование: Combining the layers under heat and pressure.
Бурение: Creating holes for through-hole components and vias.
Solder Mask Application: Protecting the circuit from solder bridges and environmental factors.
Silkscreen Printing: Adding text and symbols for component placement and identification.
Контроль качества: Ensuring the PCB meets all design specifications and standards.