High Frequency High Speed PCB Design

Structure and Composition

Base Plate and Layers

The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second layer of the solder resist ink layer is also present.

Substrate Divisions

The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and the inlay in the high-frequency area should be located at a fixed position.

Utility Model and Design

High-Frequency Area and Auxiliary Area

The utility model provides a high-frequency hybrid splint, which is divided into two parts: a high-frequency area and an auxiliary area. It provides mechanical support.

Material Usage

The high-frequency area is independently arranged, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized, and the production cost is reduced.

Product Specifications

Classification and Layers

• High Frequency Hybrid Product Classification Layers: 6 Слои

Board Material and Thickness

• Used Board: ro4350b + ФР4
• Толщина: 1.6мм

Size and Surface Treatment

• Размер: 210mm*280mm
• Обработка поверхности: Gold-plated

Minimum Aperture and Application

• Minimum Aperture: 0.25мм
• Приложение: Communication

Функции

• High Frequency Mixed Pressure